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    DSA00260167.pdf

    • STATS ChipPAC
    • FLGA Fine Pitch Land Grid Array · Array molded, cost effective, space-saving packaging solution · Available in 1.20mm (TFLGA), 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness · Thinner tha
    • Original
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    DSA00260167.pdf preview Download Datasheet

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    AN 7823 JESD51-2 JESD51-9 TFLGA
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