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    DSAASSA00012313.pdf

    • Amkor Technology
    • data sheet Features LAMINATE FCMBGA ·Single substrate molding ·4-10 layer build up and coreless substrates ·150 µm minimum bump pitch ·Die sizes up to 20 mm ·Body sizes up to 42.5 mm ·JEDEC MS
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    DSAASSA00012313.pdf preview Download Datasheet

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    "IPC-9701" amkor flip Amkor mold compound coreless substrate IPC-9701
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