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    DSA00157486.pdf

    • Central Semiconductor
    • PROCESS CPQ090 4.0 Amp, 600 Volt TRIAC Chip TRIAC PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEO
    • Original
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    DSA00157486.pdf preview Download Datasheet

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