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    DSAZSAA00018159.pdf

    • Amkor Technology
    • Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB Pkg ExposedPad Thin Shrink Small Outline Package (TSSOP), Micro Small Outlin
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    DSAZSAA00018159.pdf preview Download Datasheet

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