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    DSASW00187146.pdf

    • Fujitsu
    • FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC BGA-176P-M02 176-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 14 Sealing method Plas
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASW00187146.pdf preview Download Datasheet

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