DSA0085366.pdf
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STMicroelectronics
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PRODUCT/PROCESS
CHANGE NOTIFICATION
PCN CRP/05/1015
SUBSTRATE METALLISATION AND LEAD FREE SOLDER BALLS
CHANGE FOR BGA PACKAGES WITH SIZE EQUAL OR BELOW 23X23
Table 1. Change Identification
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Original
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Part pricing, stock, data attributes from Findchips.com
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