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    DSA00242967.pdf

    • Amkor Technology
    • LEADFRAME data sheet PowerSOP® 2&3 Features: PowerSOP® Packages: (PSOP / PSSOP) This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power c
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    DSA00242967.pdf preview Download Datasheet

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    amkor exposed pad DS320G heat slug for JEDEC MO-166 MO166 MS-013
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