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    DSA00299973.pdf

    • Central Semiconductor
    • PROCESS CPD48V Schottky Diode High Current Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14 x 14 MILS Die Thickness 7.1 MILS Anode Bonding Pad Area
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    DSA00299973.pdf preview Download Datasheet

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