Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DASF0017979.pdf

    • Xilinx
    • Application Note: Packaging R XAPP427 (v2.5) February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and c
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DASF0017979.pdf preview Download Datasheet

    User Tagged Keywords

    BFG95 BFG957 BGA PROFILING BGA reflow guide BGG352 BGG560 CPG196 CSG225 CSG324 CSG324* reflow CSG484 FFG1136 FFG1148 FFG1155 FFG1513 FFG1517 FFG1759 FFG665 FFG672 FFG676 FFG784 FGG400 fgg456 xilinx HQG208 HQG240 ipc 610D IPC-A-610D Lead Free reflow soldering profile BGA pcb warpage in ipc standard PCG84 PQG100 PQG160 PQG208 pqg208 msl PQG240 SOG20 XAPP427
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel