DSAUTAZ0012778.pdf
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OKI Electric Industry
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DIP8-P-300-2.54
5
Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised
Epoxy resin 42 alloy Solder plating (5µm) 0.46 TYP. 2/Dec. 11, 1996
DIP14-P-3
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Original
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