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    DSA2IH00164534.pdf

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    • PACKAGE INFORMATION BUMP CHIP FEATURES PAD PITCH: UNDER 69jmi · Bump SPEC -- Bump Type: Straight Wall Type -- Bump Material: Au (Gold) -- Bump Height: 14pm ± 3nm · Bump Hardness: Below 50Hv · Bum
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    DSA2IH00164534.pdf preview Download Datasheet

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