DSAUD004896.pdf
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Texas Instruments
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MECHANICAL DATA
MBGA001 JANUARY 1997
GFM (S-PBGA-N225)
PLASTIC BALL GRID ARRAY PACKAGE
27,00 SQ
0,90
Dia Solder Balls
0,60
225 Places
24,00 SQ
16,10 SQ
1,50
3,00 TYP
A
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Original
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