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    DSA00269327.pdf

    • Central Semiconductor
    • CPQ090 PROCESS TRIAC 4.0 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Glass Passivated Mesa Die Size 90 x 90 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Are
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00269327.pdf preview Download Datasheet

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    2N6075A CPQ090 CQ202-4MS CQ223-4M TRIAC triac 4 amp
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