DSAZSAA00019611.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline HLQFP176: plastic thermal enhanced low profile quad flat package: 176 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT1304-1 C y exposed die pad X Dh A 132
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00019611.pdf preview Download Datasheet