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DSASW00416676.pdf
Manufacturer
White Electronic Designs
Partial File Text
W3H32M72E-XSBX Application Note W3H32M72E-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moistu
Type
Original
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W3H32M72E-XSBX
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