Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    Scans-008847.pdf

    • Not Available
    • HMR-10502 GaAs Monolithic Microwave Integrated Circuit 0.5 - 5.0 GHz MMIC AMPLIFIER Bonding pad widths: 0.075 (.003) Chip thickness: 0.25 (.010) Dimensions in millimeters (inches) Chip Schemati
    • Scan

    Scans-008847.pdf preview Download Datasheet

    User Tagged Keywords

    HMR-10502
    Price & Stock Powered by Findchips
    Supplyframe Tracking Pixel