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    DSA00242974.pdf

    • Amkor Technology
    • LAMINATE data sheet Package on Package (PoP) Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastr
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00242974.pdf preview Download Datasheet

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    Amkor CSP mold compound Amkor Wafer level mold compound Die B3 JEDEC Jc-11 free jedec package standards PoP PACKAGE TESTING PSVFBGA
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