Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAISS0006709.pdf

    • Central Semiconductor
    • PROCESS TRIAC CPQ090 4 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 90 x 90 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Area
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAISS0006709.pdf preview Download Datasheet

    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel