DSA00468434.pdf
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Philips Semiconductors
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INTEGRATED CIRCUITS
ADDENDUM
Contactless Single-trip Ticket ICs
MF0 IC U10 01
MF0 IC U11 01
Specification "bumped sawn wafer on UV-tape"
Product Specification
Revision 3.0
PUBLIC
Philip
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Original
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Part pricing, stock, data attributes from Findchips.com
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