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    DSAASSA00012336.pdf

    • Amkor Technology
    • data sheet Features LEADFRAME TSSOP/MSOP · Cu wire interconnect for low cost · Standard JEDEC package outlines · Multi-die production capability · Turnkey test services, including strip test o
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    • Part pricing, stock, data attributes from Findchips.com

    DSAASSA00012336.pdf preview Download Datasheet

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    78 mo 5 JEDEC MO-153 JEDEC MO-187 MO-153
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