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    DSA2IH00133215.pdf

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    • O K I Semiconductor Packaging (Unit: mm) 16-Pin Plastic DIP DIPI 6-P-300 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy S
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    DSA2IH00133215.pdf preview Download Datasheet

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    DIP22-P-400
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