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    DSAZSAA00019973.pdf

    • NXP Semiconductors
    • Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V
    • Original
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    DSAZSAA00019973.pdf preview Download Datasheet

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