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    DSAZSAA00020045.pdf

    • NXP Semiconductors
    • Package outline BGA432: plastic ball grid array package; 432 balls; body 35 x 35 x 1.75 mm B A E1 D ball A1 index area SOT952-1 E D1 A A2 A1 detail X e1 e AF
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    DSAZSAA00020045.pdf preview Download Datasheet

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