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    DSAZSAA00019624.pdf

    • NXP Semiconductors
    • Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 10 x 10 x 0.85 mm X A B D SOT1325-1 E A A1 c terminal 1 i
    • Original
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    DSAZSAA00019624.pdf preview Download Datasheet

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