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    DSA0032140.pdf

    • -
    • The Development of Component-level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola PowerPC 603TM and PowerPC 604TM RISC Microprocessors 1 1 2 John Parry , Harvey Rosten
    • Original

    DSA0032140.pdf preview Download Datasheet

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