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DSA2H003066.pdf
Manufacturer
Aries Electronics
Partial File Text
CSP/MICRO BGA Test & Burn-in Socket for Devices Up to 40mm Sq. FEATURES: · For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. · Any pitch device on 0.40mm or larger. · 4 Poi
Type
Original
Part Details
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