DSAUTAZ0014818.pdf

Manufacturer Philips Semiconductors
Partial File Text PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm D D1 SOT471-1 ball A1 index E1 E A2 A1 A det
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

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