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    DSA0010630.pdf

    • SEMIKRON
    • MiniSKiiP ® Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink 20 µm Heat sink > 10 µm 6,3 µm Fig. 1: Heat sink surface specification Heat sink must be
    • Original
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    DSA0010630.pdf preview Download Datasheet

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    IEC 326-3 MiniSKiiP MiniSKiiP 1 Package miniskiip board MiniSKiiP Package pcb board of miniskiip 2 SEMIKRON BOARD silicone paste p 12 Wacker wacker rubber
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