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    DSA00435066.pdf

    • Xilinx
    • Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 (v1.0) December 9, 2002 Summary The primary purpose of solder reflow process is to wet the
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    DSA00435066.pdf preview Download Datasheet

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    BGA PACKAGE thermal profile BGA PROFILING C-150 Lead Free reflow soldering profile BGA reflow soldering profile BGA reflow temperature bga XAPP425
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