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    DSAZSAA00019906.pdf

    • NXP Semiconductors
    • Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm SOT832-1 B D A ball A1 index area A E A2 A1 C e1 e
    • Original
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    DSAZSAA00019906.pdf preview Download Datasheet

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