DSAZSAA00011561.pdf
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NXP Semiconductors
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Reflow soldering footprint
Footprint information for reflow soldering of DFN1010D-3 package
SOT1215
1.2
0.45 (2x)
0.3
1.1
0.35 (2x)
0.4
0.25 (2x)
0.75
0.3
0.5
1.5
1
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Original
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Part pricing, stock, data attributes from Findchips.com
Findchips