Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW0042972.pdf

    • Amkor Technology
    • LAMINATE data sheet Package on Package (PoP) Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASW0042972.pdf preview Download Datasheet

    User Tagged Keywords

    0.3mm pitch csp package 0.3mm pitch package bga 0.65mm pitch BGA Amkor CSP mold compound amkor flip Amkor mold compound Amkor Technology Amkor Wafer level mold compound FCCSP JEDEC Jc-11 free mold cap PSVFBGA
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel