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DSA00260167.pdf
Manufacturer
STATS ChipPAC
Partial File Text
FLGA Fine Pitch Land Grid Array · Array molded, cost effective, space-saving packaging solution · Available in 1.20mm (TFLGA), 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness · Thinner tha
Type
Original
Part Details
Part pricing, stock, data attributes from Findchips.com
DSA00260167.pdf preview
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User Tagged Keywords
AN 7823
JESD51-2
JESD51-9
TFLGA
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