DSAE0053678.pdf
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Cooper Bussmann
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ChipTM Fuses
3216FF Series, Fast-Acting
Ordering
· Specify packaging and product code
(i.e., TR/3216FF250-R)
Soldering Method
· Wave Immersion: 260°C, 10 sec max.
· Infrared Reflow: 260°C, 30 s
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Original
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Part pricing, stock, data attributes from Findchips.com
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