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    DSADA0023318.pdf

    • Philips Semiconductors
    • PDF: 2003 Mar 27 Philips Semiconductors Package outline HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm SOT804-1 B D D1
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    • Part pricing, stock, data attributes from Findchips.com

    DSADA0023318.pdf preview Download Datasheet

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    HVQFN64 jedec package MO-220 64 MO-220 sot804
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