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Part Manufacturer Description Datasheet Download Buy Part
1825002-5 TE Connectivity Ltd ADF0404=DIP SWT,FLUSH,THRU/HL
1-1825002-4 TE Connectivity Ltd ADF08T04=DIP SWT,FLUSH,THRU/HL
1825002-1 TE Connectivity Ltd ADF0204=DIP SWT,FLUSH,THRU/HL
1-1825002-3 TE Connectivity Ltd ADF0804=DIP SWT,FLUSH,THRU/HL
1825002-9 TE Connectivity Ltd ADF0604=DIP SWT,FLUSH,THRU/HL
1-1825059-7 TE Connectivity Ltd ADF04ST04=DIP SWT,FLUSH,SMT-GW

nitto SWT-20 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
nitto SWT 10

Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Text: Meaning 00 Tested wafer 01 Sawn wafer, Gustav Wirtz ring 6", tape NITTO SWT-20 non UV-tape, tape not expanded 02 Sawn wafer, Gustav Wirtz ring 6", tape NITTO SWT-20 non UVtape, tape is expanded for delivery 03 Sawn wafer, metal frame 8", tape NITTO 2091J UV-tape, tape cannot be expanded 04 Sawn wafer, metal frame 8", tape NITTO UE-111AJ UV-tape, tape can be expanded 05 , , metal frame 8", tape NITTO SWT-20 non UV-tape, tape cannot be expanded PRODUCT CODING SYSTEM


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PDF QSP0005 MAS1234AB3 MAS1234AB3xxxxx) 98AA2 MAS9198AA2xxxxx) nitto SWT 10 nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
UE-111AJ

Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Text: Wirtz ring 6", tape NITTO SWT-20 non UV-tape, tape not expanded 02 Sawn wafer, Gustav Wirtz ring 6", tape NITTO SWT20 non UV-tape, tape is expanded for delivery 03 Sawn wafer, metal frame 8", tape NITTO 2091J UV-tape, tape cannot be expanded PRODUCT CODING SYSTEM QSP0005_WEB.026 04 , ", tape NITTO UE-111AJ UV-tape, tape can be expanded Dice in waffle pack Reserved Examples The


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PDF QSP0005 MAS1025AC MAS1025ACSAxx) MAS9124AACAxx) UE-111AJ nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
MP8000CH

Abstract: MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
Text: Lead Plastic Leaded Chip Carrier NITTO 8000CH Molding Compound Level 3 Anam-Manila, Philippines , Cypress Semiconductor Package: 84 Lead Plastic Leaded Chip Carrier Nitto MP8000CH Molding Compound , ) for all Ultra 37K and Flash 37K Products. Nitto MP8000CH 150 °C 88%Sn - 12% Pn yes Die Attach , . Cypress Semiconductor Package: 84 Lead Plastic Leaded Chip Carrier Nitto MP8000CH Molding Compound , Chip Carrier Nitto MP8000CH Molding Compound Assembly: Anam-Manila, Philippines QTP# 000102, V


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PDF 8000CH MP8000CH 37KPHIL-M CY7C373I-JC 30C/60 MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
Nitto MP8000

Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4


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PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Nitto

Abstract: MOLDING MATERIAL MP8000 Nitto MP 8000 JEDEC22 MP-8000 mp8000 Nitto MP8000 CY7C611 84-1LMISR4 JESD22
Text: Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP , Semiconductor Assembly: Asat, Hong Kong Package: 64 Ld PQFP, Nitto MP-8000 Molding Compound QTP# 98422 V , : 160 Ld PQFP (CY7C611) Mold Compound Name/Manufacturer: Lead Frame material: Nitto MP , PQFP, Nitto MP-8000 Molding Compound QTP# 98422 V. 1.0 Page 3 of 4 May, 1999 RELIABILITY TESTS , : 64 Ld PQFP, Nitto MP-8000 Molding Compound QTP# 98422 V. 1.0 Page 4 of 4 May, 1999


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PDF MP-8000 CY7C611) MP-8000 CY7C611A-NC JEDEC22 30C/60 Nitto MOLDING MATERIAL MP8000 Nitto MP 8000 mp8000 Nitto MP8000 CY7C611 84-1LMISR4 JESD22
CDA194

Abstract: mark a7 sot23
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1810, JESD78, CDA194 mark a7 sot23
Not Available

Abstract: No abstract text available
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1813, JESD78,
G700K

Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4


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PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Sumitomo G700K

Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K ablebond ablestik 8290 epoxy 8290 SUMITOMO-G600 SUMITOMO g600 UL
Text: Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4


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PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K ablebond ablestik 8290 epoxy 8290 SUMITOMO-G600 SUMITOMO g600 UL
ABLEBOND

Abstract: No abstract text available
Text: Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto , 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , Nitto MP8000 w/Q3-6646 Die Coat Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , , PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper C7025 SnPb Plate 84-1 LMISR4


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PDF DS1086L, JESD78, ABLEBOND
CDA194

Abstract: mark a7 sot23 mold compound
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1817, JESD78, CDA194 mark a7 sot23 mold compound
Ablebond 84-1 LMISR4

Abstract: No abstract text available
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1812, JESD78, Ablebond 84-1 LMISR4
PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: ® FineLine BGA® (FBGA) device packages. Devices in FBGA packages currently molded with Nitto HC-100 series , 15.000 4.000 0.005 01/12/06 PCN0515 Appendix 3 ­ Material Properties for Nitto HC-100 series , Corporation Unit Nitto HC-100 series cm sec poise ppm ppm o C kg/mm2 kg/mm2 ohm.cm ohm.cm 135-150 33-36 50-60 8 34-35 140 17 2700 2.01 30 20 01/12/06 PCN0515 Altera


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PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Sumitomo G700K

Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: DS1077 ATP (Amkor, PI) 8 SOIC 150x1.4 Nitto MP8000 w/BCB4026 Die Coat Stamped Copper CDA194 SnPb , Code Range: DS1077 ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026 Die Coat Stamped , / 0.5% Copper 150 Å DS1077L ATP (Amkor, PI) 8 SOIC 150x1.4 Nitto MP8000 w/BCB4026 Die Coat , (JEDEC J-STD20A) FA# DS1077L ATP (Amkor, PI) 8 SOIC 150x1.4 Nitto MP8000 w/Q3-6646 Die Coat , (JEDEC J-STD20A) Date Code Range: DS1077L ATP (Amkor, PI) 8 uSOP 3x0.85 Nitto MP8000 w/BCB4026


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PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
PCN0119

Abstract: Nitto-HC100 HC100 shin-etsu nitto hc100 672-BALL Nitto HC EP20K300E EP20K200E Nitto
Text: PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall package dimensions, or the , changing from Shin Etsu to Nitto HC-100 to improve package coplanarity during high-temperature reflow , . Altera Corporation 11/ 20 /01 PCN0119 Altera


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PDF PCN0119 HC-100. HC-100 EPF10K100E 484-Ball EPF10K130E EP20K200E 484-Ball PCN0119 Nitto-HC100 HC100 shin-etsu nitto hc100 672-BALL Nitto HC EP20K300E Nitto
2012 - Not Available

Abstract: No abstract text available
Text: ±100MHz Output Impedance 50Ω Output VSWR 25dB min. 2.0 Max Typ. 11dBm Min. 5dBm Pout at 1dB , 50Ω Polarization RHCP Output VSWR Max 2.0 Operation Temperature -40°C to + 85 , . Radiation Patterns 6.1 XZ Plane Radiation 0 8 5 0 -5 -10 -15 - 20 -25 -30 -35 90 270 -40 , -10 -15 - 20 -25 -30 -35 90 270 -40 180 Pattern 1 Model No. AP , 6.3 XY Plane Radiation 0 8 5 0 -5 -10 -15 - 20 -25 -30 -35 90 270 -40 180


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PDF SPE-11-8-094/D/SS
PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: ASE Taiwan Nitto GE-100LFCS series Sumitomo G770 series Amkor Korea Amkor Philippines , Cycle "B" FBGA 896 450 hrs PCL3 + HAST Nitto GE-100LFCS series 0/25 High Temp Bake @ , 0.16 25 5.5 25 1 10/17/07 PCN0712 Appendix 5 Material Properties for the Nitto GE , °C ppm/° C ppm/° C N/mm2 N/mm2 N/mm2 N/mm2 E + 14 ohm-cm E + 12 ohm-cm - Nitto GE


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PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
1997 - Nitto 5015

Abstract: nitto denko adhesive DAC2450CT1 nitto denko 5015 N5015 nitto tape
Text: (0dBi typ.) max. -10 ~ +60° C - 20 ~ +85° C 4g DIMENSIONS DAC SERIES 9.7 0.5 max Mounted with , element on PCB using double sided adhesive tape of 0.12mm thickness. (Recommend No. 5015 : NITTO DENKO , Unit: mm Material: Nitto N5015 The information furnished by TOKO, Inc. is believed to be accurate


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PDF DAC2450CT1 CF-162-DACDS297 0397O2 Nitto 5015 nitto denko adhesive DAC2450CT1 nitto denko 5015 N5015 nitto tape
Not Available

Abstract: No abstract text available
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1818, JESD78,
mark a7 sot23

Abstract: No abstract text available
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1815, JESD78, mark a7 sot23
mark a7 sot23

Abstract: J-STD-20A atec 6710S CDA194 mp8000
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1816, JESD78, mark a7 sot23 J-STD-20A atec 6710S CDA194 mp8000
LMISR4

Abstract: No abstract text available
Text: : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1811 ATEC 3 SOT23 50x0.9 Nitto MP8000C , : Moisture Sensitivity (JEDEC J-STD20A) Date Code Range: DS1814 Carsem 5 SOT23 60x1.2 Nitto MP8000C , (JEDEC J-STD20A) FA# DS1814 Fastech 5 SOT23 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb , : DS1818 ATEC 3 SOT23 50x0.9 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy , 60x1.2 Nitto MP8000C Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled Ablebond Au


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PDF DS1811, JESD78, LMISR4
CCL-HL832NX-A

Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS CCL-HL832NX GE-100-LFC GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Text: wire Cu wire: PCC Mold compound: Nitto GE100LFCS* (Au Wire) or Sumitomo G750 (Cu wire) Solder balls: Pb-free Sn 3.5AG TEPBGA-1 (Qualified L2AA/260C) * Nitto GE100LFCS is not suitable , Wafer sort 256 Pin x 20 MHz test system available -55 °C to + 125 °C test available Tape and Reel


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PDF CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS CCL-HL832NX GE-100-LFC GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
PCN0415

Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera altera top marking HC100 HC100XJAA altera marking mold compound
Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera® FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function. Reason for Change: In addition to supporting Pb free and green package requirements, Nitto Denko's HC100-XJAA mold compound was found to provide superior performance with low


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PDF PCN0415 HC100-XJ HC100-XJAA PCN0415 Nitto Denko HC100-XJ Denko trace code altera altera top marking HC100 HC100XJAA altera marking mold compound
capacitor vehicle mttf

Abstract: J-STD-020 S9730 ablebond 293 Nitto
Text: 175 Å ATK (Amkor, K) 44 PLCC 650x650x3.87 Nitto MP8000C Etched copper SnPb Plate 84-1 LMISR4 , (Amkor, PI) 44 PLCC 650x650x3.87 Nitto MP8000C Stamped Copper CDA151 SnPb Plate 8361J Epoxy , ) Date Code Range: Hana 44 PLCC 650x650x3.87 Nitto MP8000C Etched copper SnPb Plate 84-1 LMISR4


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PDF DS2153, MIL-STD-883-2004 capacitor vehicle mttf J-STD-020 S9730 ablebond 293 Nitto
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