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PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Text: heading to "Nitto MP8000CH4" Update to include Qualification data for G600 (Appendix 2) Re-number the , MP8000CH4 The Sumitomo G600 and G700 mold material has been fully qualified by Altera. The qualification , the Nitto MP8000CH4 Mold Compound Material Properties Spiral Flow Gel Time (at 175°C) Thermal , /° C °C cal/cm.sec.° C kg/mm2 kg/mm2 -cm UL-94 % weight gain ppm ppm Nitto MP8000CH4


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PDF PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg
PCN0801

Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
Text: 1.0 mil Wire 1.0 mil Hitachi EN4900 Hitachi EN4900 Ablestik 8290 Nitto MP8000CH4-2 Nitto MP8000CH4-2 Sumitomo G600 Recommended Action This change does not affect the form, fit, or function of


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PDF PCN0801 PCN0801; PCN0801 hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
8361J

Abstract: mp8000ch4 Ablestik sumitomo crm g700l R6786-24 EME-G700L sumitomo EME G700L SUMITOMO g700l SUMITOMO 7351LS
Text: 85/15 Sn/Pb 1.25 mil Au Ink New Amkor, Philippines Nitto MP8000CH4 Ablestik 8361J Cu 194 85 , 6650E Ablestik 8361J Cu 194 85/15 Sn/Pb 1.25 mil Au Ink New Amkor, Philippines MP8000CH4 , 6650E Ablestik 8361J Cu 194 85/15 Sn/Pb 1.25 mil Au Ink New Amkor, Philippines Nitto MP8000CH4


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PDF CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm g700l R6786-24 EME-G700L sumitomo EME G700L SUMITOMO g700l SUMITOMO 7351LS
A194FH

Abstract: AOZ8000CI 84-3j mp8000ch4 A194-FH SS MARKING sot23 IEC-61000-4-2 2P3M a194 MP-8000CH4
Text: MP8000CH4 Pure Tin 2 III. Qualification Tests Requirments · · 2 lots of AOZ8000CI up to 168 hrs


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PDF AOZ8000CI, AOZ8000CI. AOZ8000CI 617x10-5 -105D A194FH 84-3j mp8000ch4 A194-FH SS MARKING sot23 IEC-61000-4-2 2P3M a194 MP-8000CH4
AOZ1075AI

Abstract: aoz1075 G700HC AOZ107 2a 200v schottky diode AOZ1094DI aoz1094 AOZ1015AI BA004 1015AI
Text: -mil/2-mil MP8000CH4 or G700HC III. Qualification Tests Requirements · · · · · · 2 lots of AOZ1016AI


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PDF 016AI/1017AI/1015AI/1019AI/1075AI/1081AI/ 1017DI/1094DI, AOZ1016AI/1017AI/1015AI/1019AI/ 1075AI/1081AI/1017DI/1094DI. 1015AI/1019AI/1075AI/1081AI/1017DI/1094DI 617x10-5) 77E-8 -105D AOZ1075AI aoz1075 G700HC AOZ107 2a 200v schottky diode AOZ1094DI aoz1094 AOZ1015AI BA004 1015AI
MC81F4104M

Abstract: MC81F4104S MC81F ABOV 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor
Text: : 8SOP - Molding Compound : MP-8000CH4 - Lead-Frame Material : Alloy (C194) - Lead-Frame Paddle Size : 90


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PDF MC81F4104x MC81F4104M, MC81F4104S) AQA-09-06-03 MC81F4104M MC81F4104S 10TSSOP MC81F ABOV 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor
1999 - A9701

Abstract: XC2318/L XCS40 failure XC95XX vqfp100 package XC3390A xc4310 XC9500 XC7000 XC1700D
Text: 7320C 7304 MP8000CH4 1 x 1013 1 x 1013 1 x 1013 5.5 x 1013 Boil 48 hrs (wt%) 0.3


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PDF PLCC-20, A9701 XC2318/L XCS40 failure XC95XX vqfp100 package XC3390A xc4310 XC9500 XC7000 XC1700D
1999 - XcxxX

Abstract: vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent
Text: %) (cm) Na+ (ppm) CI - (ppm) 25C 25C 6300HS 7320C 7304 MP8000CH4 1 x 1013 0.3/24 hrs 80 <1 5 12 1200


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PDF PLCC-20, XcxxX vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent
XC95XXXL

Abstract: XC95XXX PQFP240 XC1765D C17S xc9536 XCV1000E FG A9903 MIL-PRF38535 Reliability Test Methods for Packaged Devices
Text: Conditions Volume Resistivity (Ohm.cm) Water Absorption ) 150C 6300HS 7320C 7304 MP8000CH4


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PDF XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA XC95XXXL XC95XXX PQFP240 XC1765D C17S xc9536 XCV1000E FG A9903 MIL-PRF38535 Reliability Test Methods for Packaged Devices
2000 - 121C-2

Abstract: XC1765D XC95108 XL reliability report p103 pot datasheet mp8000ch4 PQFP240 XC95xxx D1 PGA 478 sumitomo epoxy eme6300h
Text: Conditions Volume Resistivity (Ohm.cm) Water Absorption ) 150C 6300HS 7320C 7304 MP8000CH4


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PDF XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA 121C-2 XC1765D XC95108 XL reliability report p103 pot datasheet mp8000ch4 PQFP240 XC95xxx D1 PGA 478 sumitomo epoxy eme6300h
CY62128-SC

Abstract: mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22
Text: Compound Flammability Rating: S32456 32-lead Plastic Small Outline IC (SOIC) NITTO MP8000CH4-A2 V-O


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PDF 45-lead CY62148 CY62128-SC 619922743M CY62128-SC mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22
nitto 201

Abstract: mp8000ch4 8361H CY62128B MP8000CH4-A2 MP8000C 7C62128
Text: Compound Flammability Rating: S324510 32-lead SOIC Nitto MP8000CH4-A2 V-O per UL94 Oxygen Rating


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PDF R52LD-5R CY62128B CY62128B-ZAC CY62128B-SC nitto 201 mp8000ch4 8361H CY62128B MP8000CH4-A2 MP8000C 7C62128
mp8000

Abstract: MP8000CH4-A2 CY62128-SC 8361H JESD22 MP8000CH4
Text: /Manufacturer: Lead Frame material: Nitto MP8000CH4-A2 Copper Lead Finish, composition: Solder Plated


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PDF 400-mil 450-mil MP8000CH4-A2 8361H CY62128-SC 619922743M 619922743M2 mp8000 MP8000CH4-A2 CY62128-SC 8361H JESD22 MP8000CH4
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