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LT1017MJ8/883 Linear Technology LT1017 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
LT1018MJ8/883 Linear Technology LT1018 - Micropower Dual Comparator; Package: CERDIP; Pins: 8; Temperature: Military
LM108AJ8 Linear Technology LM108A - Operational Amplifiers; Package: CERDIP; Pins: 8; Temperature: Military
LTC1041MJ8/883 Linear Technology LTC1041 - BANG-BANG Controller; Package: CERDIP; Pins: 8; Temperature: Military
RH137KDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator
RH137HDICE Linear Technology IC VREG ADJUSTABLE NEGATIVE REGULATOR, UUC3, DIE-3, Adjustable Negative Single Output Standard Regulator

mil-std-202 213 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2002 - mil-std-202 106

Abstract: MIL-STD pcb connector T-flash
Text: : : 11msec. : X, Y, Z 3 18 MIL-STD-202 213 A 3.5.9 Physical Shock No electrical discontinuity , directions of X, Y and Z axes, totally 18 drops. MIL-STD- 202 Method 213 Condition A 95% : 230±5 , Standards and Specifications A. MIL-STD- 202 A. MIL-STD- 202 Test Method for Electronic and Electric , 100M 500VDC 1 MIL-STD- 202 302 B 3.5.4 Insulation Resistance 1000M Min. Initial Impressed voltage 500VDC for 1 minute. 100M Min. Final Test between adjacent circuits. MIL-STD- 202


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PDF 21FEB05 mil-std-202 106 MIL-STD pcb connector T-flash
TT6P3-0836F-2520

Abstract: No abstract text available
Text: listed below. Packaging Designation Quality Environmental Performance Vibration MIL-STD- 202 ,204,A Shock MIL-STD-202 , 213 ,A Humidity MIL-STD- 202 ,103.B Heat Shock MIL-STD- 202 ,107


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mil-std-202 213

Abstract: conn sd mil-std-202 method 108 MIL-STD-202-106 sd card conn C5402 EN-37
Text: 7h F DC 1mA 6 2 490 m/s (50G) 3 (JIS C0041/ MIL-STD-202 213 ) 4-3-4 Shock Mate dummy , Peak value: 490 m/s (50 G) Duration: 11 ms (JIS C0041/MIL-STD- 202 Method 213 ) 7h F 9&É É , (JIS C5402 5.2 / MIL-STD- 202 W 3 Dielectric Strength DC 500V 1000 mega ohms minimum. 302) Apply 500V DC between adjacent pins or pin and ground. (JIS C5402 5.2 / MIL-STD- 202 Method 302) W Ç 0 500V 1 (JIS C5402 5.1 / MIL-STD- 202 4-1-3 80 milliohms maximum. AC (rms


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PDF PS-54965-004 EN-37-1 J2002-1066 mil-std-202 213 conn sd mil-std-202 method 108 MIL-STD-202-106 sd card conn C5402 EN-37
2009 - EIA-364-8

Abstract: EIA-364-98
Text: . 3.4m/s X,Y,Z 3 18 MIL-STD-202 213 A Accelerated Velocity :490m/s2 No electrical discontinuity , X, Y and Z axes, totally 18 drops MIL-STD- 202 Method 213 , condition A Fig. 2 () Fig. 2 (CONT , Specifications: A.MIL-STD- 202 : Test methods for Electronic And Electrical Component Parts B.EIA364: Electrical , .114-5206 B.501-5188 2.2 A.MIL-STD- 202 : B.EIA364: / 213-8535 3-5-8 Tyco Electronics Japan G.K , open circuit at 50mA. Refer to Fig. 4 EIA364-23 3VAC 1 0.5A MIL-STD- 202 301 No creeping


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PDF 17NOV2010 D-5000 D-5000 114-52s EIA-364-8 EIA-364-98
Not Available

Abstract: No abstract text available
Text: 4-3-6 No Damage (JIS C0041/ MIL-STD-202 213 ) 490m/s { 50G } , 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD- 202 Method 213 ) Shock 4-3-5 30 °C MAX. Contact Resistance (UL 498 , 6 hG€ 4-2-2 100 Megohm MIN. 6 hG€ AC(rms) 500V ( ) 1 (JIS C5402 5.1/MIL-STD- 202 , C5402 5.1/MIL-STD- 202 Method 301) Item 4-2-1 6 hG€ 40 milliohm MAX. 6 hG€ DC 500V (JIS C5402 5.2/MIL-STD- 202 302) Mate connectors, apply 500V DC between adjacent terminal or ground


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PDF JC2000-0839 JC2001-0402 JC2002-0650 J2002-0909 J2003-2604 J2004-3963 PS-54722-005 PS54722005 EN-37-1
EN-37

Abstract: c5402 mil-std-202 method 108
Text: / MIL-STD-202 213 ) Mechanical Shock 490m/s { 50G } , 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD- 202 Method 213 ) 85±2°C 96 1 Heat Resistance (JIS C0021/MIL-STD- 202 $P 6 Cold , 500V (JIS C5402 5.2/MIL-STD- 202 302) 4-1-2 Insulation Resistance 100 Megohms MIN. Mate connectors and apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) $P 6 6 hG Ç 0 4-1-3 Dielectric Strength 6 hG AC(rms) 250V ( 1 (JIS C5402 5.1/MIL-STD- 202


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PDF PS501571001 EN-37-1 J2005-2165 J2005-2880 PS-501571-001 EN-37 c5402 mil-std-202 method 108
2002 - micro SD Card connector

Abstract: 108-78337 micro sd card mil-std-202 213 1871602-2 micro sd r40m 25c8 MIL-STD-202 METHOD 213 micro sd drawing
Text: MIL-STD-202 213 A 2 Accelerated Velocity : 490 m/s 50 G Waveform : Semi-Sine Shall occur , . MIL-STD- 202 Method 213 Condition A 90% : 245±3°C : 3±0.5 : Sn-3Ag-0.5Cu 3.5.11 , . 501-5756 : Test Report 2.2 2.2 Commercial Standards and Specifications A. MIL-STD- 202 A. MIL-STD- 202 Test Method for Electronic and Electric Parts Tel: - Tel:- Fax:-Fax:- , 1000M 500VDC 1 100M MIL-STD- 202 302 B Insulation Resistance 1000M Min. Initial


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PDF 12JUL06 micro SD Card connector 108-78337 micro sd card mil-std-202 213 1871602-2 micro sd r40m 25c8 MIL-STD-202 METHOD 213 micro sd drawing
2005 - NON ZIF CONNECTOR

Abstract: JIS-C-5402 c002-2
Text: No Damage 50 milliohm MAX. (JIS C0041 / MIL-STD-202 213 ) 2 490 m/s { 50G }, 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD- 202 Method 213 ) FPC/FFC 85 2 96 ( JIS C0021/MIL-STD- 202 108) 85 2 , 96 , Resistance 30 milliohm MAX. 4-1-2 Insulation Resistance DC 500V (JIS C5402 5.2/MIL-STD- 202 302) Mate applicable FPC/FFC, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 , 500V 6 hG 1 6 No Breakdown 301) Dielectric Strength (JIS C5402 5.1/MIL-STD- 202 Mate


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PDF J2004-4007 PS52806003 PS-52806-003 EN-37-1 J2003-1091 NON ZIF CONNECTOR JIS-C-5402 c002-2
JIS D 2001

Abstract: C5402 EN-37 aaei
Text: Shock Appearance 3 (JIS C0041/ MIL-STD-202 213 ) Contact Resistance No Damage 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD- 202 Method 213 ) 70 , ) 4-1-2 Insulation Resistance - DC 500V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. Mate connectors, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 , (JIS C5402 5.1/MIL-STD- 202 301) No Breakdown Mate connectors, apply 500V AC(rms) for 1 minute


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PDF JC80030 JC90254 JC00044 J2002-1543 PS-54167-002 PS54167002 ES-40000-3996 95/MAR/10 U5-0926 DCBRD03 JIS D 2001 C5402 EN-37 aaei
2002 - C0023

Abstract: mil-std-202 201
Text: (JIS C0041/ MIL-STD-202 213 ) 490m/s {50 },3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD- 202 Method , /MIL-STD- 202 302) Connectors shall be mated and apply 500V DC between adjacent terminals or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) $P 6 6 hG 6 hG Ç 0 AC 500V (JIS C5402 5.1/MIL-STD- 202 301) Connectors , /MIL-STD- 202 Method 301) 6 hG 20mV 10mA Crimped the applicable wire on to the terminal, measure by dry , Test Conditions 3 10 55 10 Hz/ 1.5mm 2 (MIL-STD- 202 201) Amplitude : 1.5mm P-P Sweep time: 10-55-10 Hz


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PDF PS-51090-005 EN-37-1 J2002-2334 C0023 mil-std-202 201
2002 - C0023

Abstract: No abstract text available
Text: MAX. No Damage Appearance Contact Resistance 4-3-4 Shock 3 (JIS C0041/ MIL-STD-202 213 ) 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C0041/MIL-STD- 202 Method 213 ) 40 milliohms , Insulation Resistance -DC 500V (JIS C5402 5.2/MIL-STD- 202 302) Mate connectors, apply 500V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) - -AC(rms) 4-1-3 1000V 1 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors, apply 1000V AC(rms) for 1 minute between adjacent terminal or


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PDF J2002-1997 PS000074 PS-5244-003 ES-40000-3996 95/MAR/10 U5-0926 DCBRD03 EN-37-1 C0023
2002 - mil-std-202 201

Abstract: 20n20 sn 357 mil-std-202 106 1717169-2
Text: : : 11msec. : X, Y, Z 3 18 MIL-STD-202 213 A 3.5.11 Physical Shock 2 No electrical , , Y and Z axes, totally 18 drops. MIL-STD- 202 Method 213 Condition A Fig. 1 Fig. 1 CONT. 6 of , INTERFACE CONNECTOR 14Pos. 14Pos. 108108-5887 Rev.A Rev.A A. MIL-STD- 202 A. MIL-STD- 202 , leakage : 0.5mA Max. connectors. 500M 500VDC 50M 3.5.3 MIL-STD- 202 302 B , Test between adjacent circuits of mated connectors. MIL-STD- 202 , Method 302, Condition B Fig. 1


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PDF 14Pos. 29FEB08 10sec 14Pos mil-std-202 201 20n20 sn 357 mil-std-202 106 1717169-2
2000 - D5200

Abstract: D-5200 D-5200S
Text: A MIL-STD-202 , 213 , A Accelerated Velocity :490 m/s2 Waveform : Sinwave Shall occur , Commercial Standards and Specifications : 2 MIL-STD- 202 Test Methods for Electronic and MIL-STD- 202 , 0.5 mA AMP 109-5301 MIL-STD- 202 301 3kVAC 1 minute. No creeping discharge nor flashover , Spec. 109-5301 MIL-STD- 202 Method 301 1000 M 500 V DC AMP 109-5302 MIL-STD- 202 302 B 1000 , . 109-5302 MIL-STD- 202 Method 302 Condition B 30 °C Fig. 3 AMP 109-5310 30 °C Max. under loaded


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PDF D-5200 D-5200Series D5200 D-5200S
Not Available

Abstract: No abstract text available
Text: sec. : X, Y, Z 3 18 AMP 109-5208 MIL-STD-202 , 213 A 20 m Max. (Final) · Mated connectors 9 , MIL-STD- 202 , Method 213 Condition A 3.5.8 Connector Mating/Unmating Force Mating Force Unmating Force 4.9N , Specification (Crimp Type) 2.2 A. MIL-STD- 202 : B. IEC.512 : 2.1 Commercial Standards and Specifications : A. MIL-STD- 202 B. IEC 512 Test Specification - Tel Fax This AMP controlled document , Procedures 3.5.3 1000 M () 100 M () 500 V DC MIL-STD- 202 , 302 B AMP 109-5302 108-78400 1 J


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PDF D-3900 D-3900 01JUL2008 D3900SERIES D3900
axis sd card

Abstract: SD Card Package tray C5402 EN-37 mil-std-202 213 PS54965005 54965-0971
Text: 490 m/s (50G) 3 (JIS C0041/ MIL-STD-202 213 ) 4-3-4 Appearance Discontinuity 1.0 , . (JIS C5402 5.4) W 4-1-2 Insulation Resistance W Ç 0 (JIS C5402 5.2 / MIL-STD- 202 4-1-3 , ground. (JIS C5402 5.2 / MIL-STD- 202 Method 302) W 3 JAPANESE ENGLISH W Ç 0 AC (rms)500V 1 (JIS C5402 5.1 / MIL-STD- 202 301) Apply 500V AC (rms) for 1 minute between adjacent pins or pin and ground. (JIS C5402 5.1 / MIL-STD- 202 Method 301) 7h F No Breakdown F The


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PDF PS-54965-005 EN-37-1 PS54965005 J2004-2505 axis sd card SD Card Package tray C5402 EN-37 mil-std-202 213 54965-0971
JIS C60068

Abstract: JIS C60068-2-1 MIL-STD-202 METHOD 213 PS 117 C5402 EN-37
Text: (UL 498) Mechanical Shock Appearance Heat Resistance (JIS C60068-2-27/ MIL-STD-202 213 ) 490m/s { 50G } , 3 strokes in each X.Y.Z. axes. (JIS C60068-2-27/MIL-STD- 202 Method 213 ) 85±2°C 96 , 250V (JIS C5402 5.2/MIL-STD- 202 4-1-2 Insulation Resistance 100 Megohm MIN. Mate connectors and apply 200V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) $P , 5.1/MIL-STD- 202 ) 301) No Breakdown Mate connectors and apply 250V AC(rms) for 1 minute


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PDF J2004-3738 J2005-0696 J2006-1916 J2007-2520 PS-51338-002 PS51338002 EN-37-1 JIS C60068 JIS C60068-2-1 MIL-STD-202 METHOD 213 PS 117 C5402 EN-37
C5402

Abstract: EN-37 PS-502382-001
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be , Method 213 ) 30 ° MAX. C Vibration DC 1mA 3 10 55 10 Hz/ 1.52mm 2 (MIL-STD- 202 201 , Electrical performance DC 250V (JIS C5402 5.2/MIL-STD- 202 302) AC(rms) 500V ( 1 2 (JIS C5402 5.1/MIL-STD- 202 301) ) No Breakdown Mate connectors and apply 500V AC(rms) for 1 minute between adjacent terminal or ground. Trip current 2mA. (JIS C5402 5.1/MIL-STD- 202 Method 301) 20mV 5


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PDF J2007-3489 PS502382001 EN-37-1 PS-502382-001 J2007-1471 C5402 EN-37 PS-502382-001
2009 - Not Available

Abstract: No abstract text available
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 , 250V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors


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PDF PS502382001 PS-502382-001 EN-37-1 J2007-1471 J2007-3489
2009 - Not Available

Abstract: No abstract text available
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 , 250V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors


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PDF PS502382001 PS-502382-001 EN-37-1 J2007-1471 J2007-3489
2009 - Not Available

Abstract: No abstract text available
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 , 250V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors


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PDF PS502382001 PS-502382-001 EN-37-1 J2007-1471 J2007-3489
2009 - Not Available

Abstract: No abstract text available
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 , 250V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors


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PDF PS502382001 PS-502382-001 EN-37-1 J2007-1471 J2007-3489
2009 - Not Available

Abstract: No abstract text available
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 , 250V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors


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PDF PS502382001 PS-502382-001 EN-37-1 J2007-1471 J2007-3489
2002 - SD Card connector

Abstract: sd card mil-std-202 213 78220 MIL-STD-202 METHOD 302 "MIL-STD-202" "METHOD 302" "CONDITION B" axis sd card
Text: 18 MIL-STD-202 213 A 3.5.10 Physical Shock 2 No electrical discontinuity Accelerated , , totally 18 drops. MIL-STD- 202 Method 213 Condition A Fig.1 Fig.1. 6 of 14 SD Card CONNECTOR , 2.2 Commercial Standards and Specifications A. MIL-STD- 202 A. MIL-STD- 202 Test Method for , 100M MIL-STD- 202 302 B Insulation Resistance 1000M Min. Initial Impressed voltage 500VDC for 1 minute. 100M Min. Final Test between adjacent circuits. MIL-STD- 202 , Method 302


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PDF 15FEB06 SD Card connector sd card mil-std-202 213 78220 MIL-STD-202 METHOD 302 "MIL-STD-202" "METHOD 302" "CONDITION B" axis sd card
2009 - Not Available

Abstract: No abstract text available
Text: . 4-3-4 Mechanical Shock DC 1mA 6 490m/s { 50G } 11ms 3 (JIS C0041/ MIL-STD-202 213 ) Mate , value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 ) Appearance No , (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors and apply


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PDF PS-502382-001 PS502382001 EN-37-1 J2007-1471 J2007-3489
2009 - Not Available

Abstract: No abstract text available
Text: / MIL-STD-202 213 ) Mate connectors and subject to the following shock conditions. 3 shocks shall be applied , pulse : Half Sine Peak value : 490 m/s2 (50 G) Duration : 11 ms (JIS C0041/MIL-STD- 202 Method 213 , 250V (JIS C5402 5.2/MIL-STD- 202 302) 100 Megohms MIN. 4-1-3 Dielectric Strength AC(rms) 500V () 1 2 (JIS C5402 5.1/MIL-STD- 202 301) Mate connectors and apply 250V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD- 202 Method 302) No Breakdown Mate connectors


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PDF PS502382001 PS-502382-001 EN-37-1 J2007-1471 J2007-3489
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