Amkor Technology
Datasheets
30
| Part | Description | ECAD Model | Datasheet | Size | Page count |
|---|---|---|---|---|---|
| CABGA | ChipArray Packages |
|
300.60 KB | 2 | |
| CBGA | From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. |
|
500.43 KB | 1 | |
| CDIP | Ceramic Dual-Inline Package |
|
369.49 KB | 1 | |
| CERDIP | Ceramic Dual-Inline Package |
|
369.49 KB | 1 | |
| CERPAK | Ceramic Pack |
|
284.81 KB | 1 | |
| CLGA | Ceramic Land Grid Array Package |
|
353.14 KB | 1 | |
| CMCM | Ceramic Multi-Chip Module Package |
|
299.44 KB | 1 | |
| CPGA | Ceramic Pin Grid Array Package |
|
528.68 KB | 1 | |
| CQFP | Ceramic Quad Flat Pack Package |
|
328.33 KB | 1 | |
| CSOIC | Ceramic Small Outline Integrated Circuit Package |
|
369.49 KB | 1 | |
| CSPNL | Wafer Level Packaging |
|
154.01 KB | 2 | |
| CSSOP | Ceramic Shrink Small Outline Package |
|
299.87 KB | 1 | |
| CTBGA | ChipArray Packages |
|
300.60 KB | 2 | |
| CVBGA | ChipArray Packages |
|
300.60 KB | 2 | |
| ETCSP | the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. |
|
144.50 KB | 2 | |
| FCCSP | a flip chip solution in a CSP package format. |
|
115.63 KB | 2 | |
| FLATPACK | Ceramic Flat Pack Package |
|
486.21 KB | 1 | |
| LCC | Leadless Chip Carrier Package |
|
455.41 KB | 1 | |
| LQFP | Low Profile Quad Flat Pack (LQFP) Packages |
|
651.91 KB | 2 | |
| LQFPPOWERQUAD2 | LQFP PowerQuad 2 Packages |
|
130.58 KB | 2 | |
| LQFPPOWERQUAD4 | LQFP PowerQuad 4 Packages |
|
133.00 KB | 2 | |
| MCMPBGA | Innovative designs and expanding package offerings provide a platform from prototype-to-production |
|
120.33 KB | 2 | |
| MQFP | Amkors MQFP IC package portfolio provides |
|
384.88 KB | 2 | |
| MQFPPOWERQUAD2 | Exceptional thermal and electrical performance by design include the following |
|
90.41 KB | 2 | |
| PBGA | Innovative designs and expanding package offerings provide a platform from prototype-to-production |
|
289.56 KB | 2 | |
| PDIP | Amkors PDIP packages offer |
|
388.97 KB | 2 | |
| PLCC | Amkors PLCC IC package portfolio provides |
|
382.31 KB | 2 | |
| POWERSOP2 | Exceptional performance through the innovative design of PSOPs offer |
|
309.69 KB | 2 | |
| PPGA | Plastic Pin Grid Array Package |
|
300.23 KB | 1 | |
| PSVFBGA | Package on Package (PoP) Family |
|
242.19 KB | 2 |