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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA
LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA
LTM4600IV#2DHPBF Linear Technology LTM4600 - 10A High Efficiency DC/DC µModule; Package: LGA; Pins: 104; Temperature: Industrial
LTM9004IV-AD#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C

lga components Datasheets Context Search

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dscc 07016

Abstract: human radar detection radar human detection CWR29 MIL-PRF-55365 lga components
Text: , temperature extremes), highly reliable, able to power-up after periods of dormancy and based on components , / 6v device. Figure 1 In order to minimize current loop, a new series of Land Grid Array ( LGA ) components has been developed having extremely tightly controlled termination dimensions. Using a vertical , for a small 0306 4.7uF / 6v device. Figure 2 Image 3, LGA Series For many avionics or


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PDF D0-160 dscc 07016 human radar detection radar human detection CWR29 MIL-PRF-55365 lga components
Not Available

Abstract: No abstract text available
Text: components with minimal obsolescence. AVX can improve power distribution quality, over a wide spectrum of , ¼F / 6v device. Figure 1 In order to minimize current loop, a new series of Land Grid Array ( LGA ) components has been developed having extremely tightly controlled termination dimensions. Using a vertical , for a small 0306 4.7μF / 6v device. Figure 2 Image 3, LGA Series For many avionics or


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PDF D0-160
2009 - LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control "BGA Rework Practices", AN1902 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework 221-O
Text: ) assembly solder pasted used. · LGA eliminates risk that customers receive components with missing or , properly disposed of so that they will not mix in with new LGA components . 4.2 Site Preparation , Grid Array ( LGA ) Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array ( LGA ) style package. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array


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PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control "BGA Rework Practices", AN1902 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework 221-O
2005 - metcal apr 5000

Abstract: NZA-555-555-CGA reflow temperature bga laptop APR-5000-XL APR-5000-XLS APR-5000 NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA BST-352P
Text: Array ( LGA ) components . This is an ideal process for small components and situations where traditional , peak reflow temperature without thermal damage to sensitive components unsuitable for heating above , up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" APR-5000-XLS Array , components , with the necessary magnification to make its placement and registration fast and accurate. 5 , flexibility of custom manufactured nozzles for unusual or odd shaped components . Please contact your local


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PDF APR-5000 BRO-APR-US-05 metcal apr 5000 NZA-555-555-CGA reflow temperature bga laptop APR-5000-XL APR-5000-XLS APR-5000 NZA-270-270 PBGA 256 reflow profile NZA-350-350-CGA BST-352P
2002 - IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil QFN 16 CARSEM package outline qfn 44 PACKAGE footprint 7x7 DIe Size metcal VPI-1000 qfn 48 7x7 stencil QFN 8 CARSEM APR-5000
Text: , BGA, and LGA Components . (Photo of VPI-1000 courtesy of METCAL) April 2002 Page 18 MLP , Profile The solder reflow profile will be dependent on PCB design, PCB thickness, type of components , use a stencil thickness of 125mm (5mils) for MLP components . 4.3 Lead finger stencil design The , components of 0.5mm and below it may be necessary to reduce the stencil aperture length by 20%. This is , necessary when reflowing MLP components . As with all SMT components , it is important that profiles be


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2013 - hand movement based fan speed control

Abstract: No abstract text available
Text: solutions for high power LGA components . maxiFLOWTM custom designs for flip-chip components such as , domain, including components , circuit boards (PCBs), shelves, chassis, and system packaging. The , ; and wind tunnel testing of components , PCBs, chassis and enclosures. Prototyping Services ATS , temperature measurement and mapping of ICs and components . The measurement resolutions span from small , facility for components and boards » Sensor Calibration Services  For temperature, velocity


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PDF CWT-125 CLWTC-1000 HP-97TM hand movement based fan speed control
2013 - Not Available

Abstract: No abstract text available
Text: solutions for high power LGA components . maxiFLOWTM custom designs for flip-chip components such as , domain, including components , circuit boards (PCBs), shelves, chassis, and system packaging. The , ; and wind tunnel testing of components , PCBs, chassis and enclosures. Prototyping Services ATS , temperature measurement and mapping of ICs and components . The measurement resolutions span from small , facility for components and boards » Sensor Calibration Services  For temperature, velocity


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PDF CWT-125 CLWTC-1000 HP-97TM
1993 - pcb design of zigbee

Abstract: FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
Text: technology (SMT) assembly solder paste used. LGA eliminates the risk that customers receive components with , house used and the other components on the board. 3.1 71-Pin LGA Component Copper Layer 1.55mm , top metal layer and is the layer to which the components are soldered. The footprint for the LGA , , intended, or authorized for use as components in systems intended for surgical implant into the body, or , Grid Array ( LGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
2009 - AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS BGA PACKAGE thermal resistance Freescale fr-5 laminate BGA cte AN3311 AN1902 lga components
Text: components with missing or damaged spheres due to shipping or handling. · LGA devices have a lower mounted , Considerations for the Application of Land Grid Array ( LGA ) Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array ( LGA ) style packages. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead


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PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS BGA PACKAGE thermal resistance Freescale fr-5 laminate BGA cte AN3311 AN1902 lga components
2009 - LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN3311 fr-5 laminate AN1902 BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Text: components with missing or damaged spheres due to shipping or handling. · LGA devices have a lower mounted , Considerations for the Application of Land Grid Array ( LGA ) Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array ( LGA ) style packages. Freescale has introduced radio frequency (RF) modules such as the MC1320x and MC1321x in LGA packages as an alternative package to ball grid array (BGA). The LGA packages reduce the amounts of lead


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PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN3311 fr-5 laminate AN1902 BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
2005 - LGA voiding

Abstract: NC-SMQ230 Indalloy 181 AN2920 Solder Paste, Indium, Type 3 7313 28 pin freescale ltcc ipc 610D bga thermal cycling reliability ltcc chip
Text: ) assembly solder pasted used. · LGA eliminates risk that customers receive components with missing or , Land Grid Array ( LGA ) to reduce the amounts of lead in finished products and to become Reduction of Hazardous Substances (RoHS) compliant. This application note describes this HCTE Ceramic LGA and , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 What is LGA ? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Benefits of LGA . . . . . . . . . . . . . . . . . . . . . .


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PDF AN2920 LGA voiding NC-SMQ230 Indalloy 181 AN2920 Solder Paste, Indium, Type 3 7313 28 pin freescale ltcc ipc 610D bga thermal cycling reliability ltcc chip
2008 - LTM 4606 EVALUATION BOARD

Abstract: LTM4602 LTM4607 24v 2A regulator LTM4616 LTM4614 LTM4612 LTM4608 step down transformer 200mA LTM4605
Text: design from 32 components to one. The small and thin plastic LGA (land grid array) package features , challenge even for an expert analog designer. Besides calculating values and selecting components , there , controllers, power FETs, inductors (except for buck-boost) and additional components , all in single low profile packages. The only external components required are bulk input and output capacitors and a , . The result is a high performance DC/DC system with a very low thermal impedance land grid array ( LGA


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PDF Corporation/0908/Printed LTM 4606 EVALUATION BOARD LTM4602 LTM4607 24v 2A regulator LTM4616 LTM4614 LTM4612 LTM4608 step down transformer 200mA LTM4605
picor

Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
Text: external components . The smaller pads along the right half of the LGA are the input and output connections , to reflow the LGA , then components mounted on smaller areas of copper could be thermally damaged , ® Recommended PCB Design & Surface Mount Guidelines for Picor Corporation's LGA Packages , . . . Page 2 IPC/JEDEC Reflow Guidelines . . . . . . . . . . . . . . . . . . Page 2 LGA SIP Rework , . . . . . . . . . Page 4 ­ 5 Introduction Picor's LGA (Land Grid Array) products are high


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2005 - C25704-002

Abstract: LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a 30373 Intel socket 775 PIN LAYOUT
Text: relaxation in retention components . 10 Intel® Celeron® D Processor in the 775-Land LGA Package Thermal , Intel® Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design , changes to them. The Intel® Celeron® D Processor in the 775-Land LGA Package for Embedded Applications , Processor in the 775-Land LGA Package Thermal Design Guide Order #303730 Contents Contents 1.0 , . 26 Intel® Celeron® D Processor in the 775-Land LGA Package Thermal Design Guide Order #303730


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PDF 775-Land C69175 PSC-2U001 C25704-002 LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a 30373 Intel socket 775 PIN LAYOUT
2012 - LGA PACKAGE thermal resistance

Abstract: No abstract text available
Text: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA , solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intel’s Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molex’s LGA 2011-0 , €™). Compared with the LGA 1366 socket, the increase in the LGA 2011-0’s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA PACKAGE thermal resistance
2012 - Not Available

Abstract: No abstract text available
Text: Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA , solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intel’s Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molex’s LGA 2011-0 , €™). Compared with the LGA 1366 socket, the increase in the LGA 2011-0’s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012
2006 - LGA16 footprint

Abstract: TN0018 lga16 land pattern LGA16 L footprint lga16 land LGA14 JESD97 ST LGA-16 LGA16 LGA voiding
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface , resistance and environmental specification . . . . . . . . . . . 7 Appendix A LGA packages outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 A.1 A.2 LGA 4.4x7.5x1 mm , LGA 5x5x1.6 mm, 16 lead. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9


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PDF TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint lga16 land LGA14 JESD97 ST LGA-16 LGA16 LGA voiding
2012 - LGA 1366

Abstract: socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 LGA socket Intel lga 1156
Text: Approved by Intel and supporting its top-of-the-line Core i-7 processors, the compact LGA 2011-0 , and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket (Socket R) offers the electrical , performance levels of Intel's Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Molex's LGA 2011-0 , Compared with the LGA 1366 socket, the increase in the LGA 2011-0's contact density of 12% while , establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly retains its 3


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA 1366 socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 LGA socket Intel lga 1156
2010 - 9202076

Abstract: TH1M156ER LGA-349 LGA-472 MCGA-349 max 3734 TH1M242ER MQFPT352 324A1 TH1099ES
Text: (MCGA-349) - 349 Columns Multilayer Column Grid Array (MCGA-472) - 472 Columns Land Grid Array ( LGA -349) - 349 Pads Land Grid Array ( LGA -472) - 472 Pads Functional Diagram Pin Assignment Instruction , Electrical Measurements for Components Specified at Single Supply Voltage VDD = 2.5V Room Temperature Electrical Measurements for Components Specified at Single Supply Voltage VDD = 3V Room Temperature Electrical Measurements for Components Specified at Single Supply Voltage VDD = 3.3V Room Temperature


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2008 - lga16 land pattern

Abstract: LGA16 footprint TN0018 LGA 16L LGA16 L footprint 4x4x1 ST LGA-16 LGA16 LGA land pattern LGA14
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA , environmental specification . . . . . . . . . . . 7 Appendix A LGA packages outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 A.1 A.2 LGA 4.4x7.5x1 mm, 16 lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 A.4 LGA 3x5x0.9 mm, 14 lead. . .


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PDF TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L LGA16 L footprint 4x4x1 ST LGA-16 LGA16 LGA land pattern LGA14
LICC

Abstract: kyocera mlcc military capacitors lga components
Text: components necessary to optimize the system performance. 0306 LGA ESL ~ 35 pH Figure 2. Patterned , of the LGA system with respect to PCB component density. Unlike traditional MLCC components , the , Land Grid Array ( LGA ) Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array ( LGA ) capacitors and superior low inductance , Inductance Capacitors Land Grid Array ( LGA ) Low Inductance Capacitor Advantages in Military and


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PDF S-LGA0M806-N LICC kyocera mlcc military capacitors lga components
2008 - AN3484

Abstract: MMA73x1L LGA land pattern MMA745xL LGA14
Text: Guidelines for the LGA Accelerometer Sensor to a PC Board by: Kimberly Tuck, Cheol Han Sensors and , layout and reflow conditions. This application note is a guideline for soldering and mounting the LGA , digital output accelerometer use the Land Grid Array ( LGA ) package platform. This application note , shows the bottom view of LGA 14 lead, 3 x 5 mm individual sensor device. Figure 2 shows the , Figure 2. Recommended PCB Land Pattern for the 5 x 3 mm LGA Package OVERVIEW OF SOLDERING


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PDF AN3484 MMA73x1L MMA745xL AN3484 LGA land pattern LGA14
2013 - Not Available

Abstract: No abstract text available
Text: inspection Pack options Wafer backgrinding Encapsulated SMT components • Micro Pb-free covered LGA , ) 0.65 mm (max) 0.50 mm (max) 0.40 mm (max) Mold Cap Thickness 0.70 (BGA) 0.95 mm ( LGA ) 0.60 (BGA) 0.53 mm ( LGA ) 0.45 (BGA) 0.53 mm ( LGA ) 0.40 (BGA) 0.45 mm ( LGA ) 0.32 (BGA)* 0.40 mm ( LGA ) 0.25 (BGA) 0.32 mm ( LGA )* 0.25 mm ( LGA )* Substrate Layer 2lyr 0.32 mm , 75 µm 75 µm Die Thickness* CABGA JEDEC designator listed. * LGA options available with


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PDF DS550R
2006 - EIA-364 65A

Abstract: lga components EIA-364-65A LGA resistance 0.5mm pitch BGA EIA-364-32 EIA-364-31 EIA-364-28 EIA-364-27 LGA PACKAGE thermal resistance
Text: 0.5 mm LGA /BGA Sockets DESCRIPTION Tyco Electronics' polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides , : 1-508-699-9851 Fax: 1-508-695-8111 E-mail: allison_bobrowski@tycoelectronics.com 0.5mm LGA /BGA Sockets , characteristics are optimized. LGA Contact Compressed LOAD LGA Package LGA Pad Contact Polyimide Substrate PC Board Bolster Plate Close up of LGA corner frame and contacts The unique design of


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PDF 8-1773444-1-CC LH-PDF-07/06 EIA-364 65A lga components EIA-364-65A LGA resistance 0.5mm pitch BGA EIA-364-32 EIA-364-31 EIA-364-28 EIA-364-27 LGA PACKAGE thermal resistance
pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
Text: Rectifier's BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page , .4 LGA Devices .4 , LGA devices. Topics discussed include PCB layout placement, soldering, pick and place, reflow , Rework Guidelines for International Rectifier's BGA and LGA Packages by Kevin Hu, International Rectifier Introduction IR BGA (Ball Grid Array) and LGA (Land Grid Array) devices are high performance


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PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
Supplyframe Tracking Pixel