The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C
LTM4600IV#2DHPBF Linear Technology LTM4600 - 10A High Efficiency DC/DC µModule; Package: LGA; Pins: 104; Temperature: Industrial
LTM9004IV-AC#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C
SF Impression Pixel

Search Stock (16)

  You can filter table by choosing multiple options from dropdownShowing 16 results of 16
Part Manufacturer Supplier Stock Best Price Price Each Buy Part
CORE I3 3.06GHZ LGA1156 ADLINK Technology Inc Avnet - - -
CORE I3-2120 3.3GHZ LGA1155 ADLINK Technology Inc Avnet - - -
CORE I3-3220 3.3GHZ FCLGA1155 ADLINK Technology Inc Avnet - - -
CORE I5 2.66GHZ LGA1156 ADLINK Technology Inc Avnet - - -
CORE I5 3.33GHZ,LGA1156 ADLINK Technology Inc Avnet - - -
CORE I5-2400 3.1GHZ LGA1155 ADLINK Technology Inc Avnet - - -
CORE I5-3550S 3.0GHZ LGA1155 ADLINK Technology Inc Avnet - - -
CORE I7 2.8GHZ LGA1156 ADLINK Technology Inc Avnet - - -
CORE I7-2600 3.4GHZ LGA1155 ADLINK Technology Inc Avnet - - -
CORE I7-3770 3.4GHZ LGA1155 ADLINK Technology Inc Avnet - - -
CORE I7-3770K 3.5GHZ LGA1155 ADLINK Technology Inc Avnet - - -
DUALCORE 2.8GHZ FCLGA1156 ADLINK Technology Inc Avnet - - -
INTEL LGA 1156 2U TM ADLINK Technology Inc Avnet - - -
INTEL LGA1156 TM ADLINK Technology Inc Avnet - - -
LGA1155 Molex Chip One Exchange 32 - -
XEON E3-1225 3.1GHZ LGA1155 ADLINK Technology Inc Avnet - - -

No Results Found

Show More

lga 115 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - lga 115

Abstract: 60X13 LGA-48P-M02
Text: LAND GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC LGA -48P-M02 48-pin Plastic LGA Land pitch 1.00 mm Land matrix 6×8 Sealing method Resin seal ( LGA -48P-M02) 48-pin Plastic LGA ( LGA -48P-M02) 14.00±0.15(.551±.006) Note: The actual shape of corners may differ from the dimension. 1.10±0.20 (.043±.008) 0.40(.016) 1.15 (.045) 7.00±0.15(.276±.006) 1.15 (.045) 0.40(.016) 0.40(.016) 1.15 (.045) 10.00±0.15 (.394±.006) Ø0.60x13


Original
PDF LGA-48P-M02 48-pin LGA-48P-M02) 60x13 024x13) MCM-M004-1-1 45x48 018x48) lga 115 60X13 LGA-48P-M02
LGA 1150

Abstract: LGA 1151 LTM4617 LTM4604 LTM4602 LTM4608 ltm4607 LTM4600 LTM4613-LGA LTM4614
Text: DATE CODE NEWEST DATE CODE DEVICE HOURS (1) EQV to +125°C NUMBER OF (2)(3) FAILURES LGA 15mmx15mm LGA 15mmx9mm 1,835 0452 1048 711 0634 0740 2,546 (4) ) · TEMP TEMP, HUMIDITY BIAS (85 (85°C/85 , 125 125 · POWER CYCLE FROM +50°C to +100°C PACKAGE TYPE SAMPLE SIZE LGA 15mmx15mm 0513 0632 , LGA 15mmx15mm LGA 15mmx9mm 329 0513 1048 102 0712 0730 431 · TEMP CYCLE FROM -40°C to +125°C AFTER , ,100,000 21,725,540 0 0 0 NUMBER OF FAILURES DEVICE CYCLES LGA 15mmx15mm LGA 15mmx9mm 628


Original
PDF LTM4600 LTM4601 LTM4601A LTM4602 LTM4603 LTM4604 LTM4605 LTM4606 LTM4607 LTM4608 LGA 1150 LGA 1151 LTM4617 LTM4613-LGA LTM4614
2014 - cinterion bgs2-w

Abstract: M2M SIM cinterion ehs6
Text: ●/- ●/- ●/● ●/● Interfaces Antenna connector via pogo pads via LGA pads via LGA pads via LGA pads via LGA pads via LGA pads Mounting 80-pin LGA LGA LGA LGA LGA Audio analog/digital 1x/1x 1x/1x 1x/1x 1x/1x 1x/1x -/1x , for eCall / ERA GLONASS Interfaces Antenna connector 3 x U.FL-R via LGA pads via LGA pads via LGA pads via LGA pads via LGA pads Mounting 80-pin LGA LGA LGA LGA LGA


Original
PDF
2006 - DS4077L-CC0

Abstract: l949a
Text: Complementary Output Buffer Minimum ±110ppm Tuning Range (+25°C) 14mm x 9mm x 3.06mm Plastic LGA Package , LGA 9 LGA 9 LGA 9 LGA TOP MARK DS4077L-DCN DS4077L-DDN DS4077L-CCN DS4077L-CDN Ordering Information , CRYSTAL X2 VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION TRANSFER-MOLDED PLASTIC PACKAGE LVCMOS , -3.5 -1 +20 2.8 164 CONDITIONS MIN 3.135 TYP 3.3 20 25 fNOM MAX 3.465 30 mA 35 fNOM +8ppm + 11.5 MHz ppm , 76.8 76.8 77.76 77.76 106.25 106.25 122.88 PIN-PACKAGE 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA


Original
PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-CC0 l949a
2008 - LTM8021

Abstract: LTM4607 LTM4605
Text: — 9mm × 2.32mm LGA and 15mm × 9mm × 3.42mm BGA Packages Applications n n n n n , output capacitors are needed to complete the design. The 0.630mm LGA pads with 1.27mm pitch simplify , function. The LTM4604A is offered in RoHS-compliant 15mm × 9mm LGA and BGA packages. Typical , BGA PACKAGE 66-PIN (15mm × 9mm × 3.42mm) VOUT LGA PACKAGE 66-PIN (15mm × 9mm × 2.32mm , °C LTM4604AEV#PBF LTM4604AEV#PBF LTM4604AV 66-Lead (15mm × 9mm × 2.32mm) LGA –40°C to 125Â


Original
PDF LTM4604A LTM8021 LTM8022 LTM8023 com/LTM4604A 4604afa LTM8021 LTM4607 LTM4605
2006 - Not Available

Abstract: No abstract text available
Text: Complementary Output Buffer Minimum ±110ppm Tuning Range (+25°C) 14mm x 9mm x 3.06mm Plastic LGA Package , LGA 9 LGA 9 LGA 9 LGA TOP MARK DS4077L-DCN DS4077L-DDN DS4077L-CCN DS4077L-CDN Ordering Information , CRYSTAL X2 VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION TRANSFER-MOLDED PLASTIC PACKAGE LVCMOS , MIN 3.135 TYP 3.3 20 fNOM MAX 3.465 30 fNOM +8ppm + 11.5 UNITS V mA MHz ppm/pF ppm/pF ppm V ppm/V kHz , ) 74.17582 74.17582 74.25 74.25 76.8 76.8 77.76 77.76 122.88 PIN-PACKAGE 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA 9 LGA


Original
PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-ACN DS4077L-ADN
2009 - MPXY8600

Abstract: how to connect pressure to MPX2102 MPXY8600A MPX4250 Series mpxy8500 MPXH6250AC6T MPL115A1 MPX6115 i2c based tire pressure sensor MPXY8300A6U
Text: /second 400 0.5 1.0 -/-/2.5 2.8/1.8 1.8 I2C/SPI 3 x 5 x 1.0 mm LGA MMA7455L , LGA 3 x 5 x 1.0 mm LGA 3 x 5 x 1.0 mm LGA 3 x 5 x 1.0 mm LGA Low g Automotive and Industrial , Interface Package 2.4 - 5.5 2.4 - 5.5 10 10 50 - 115 50 - 115 ±1 ±1 -20°C ­ 85°C -20°C ­ 85°C SPI 8-pin LGA 8-pin LGA MPL115A1 MPL115A2 I2 C A Pressure Type2 D G , ±1.0 ±3.5 80 105 102 102 105 115 115 115 200 250 250 250 6.0 4.0 4.0 10 10 10 50


Original
PDF SG1010Q42009 MMA7660FC MMA7455L MPXY8600 how to connect pressure to MPX2102 MPXY8600A MPX4250 Series mpxy8500 MPXH6250AC6T MPL115A1 MPX6115 i2c based tire pressure sensor MPXY8300A6U
2009 - MPXY8300A6U

Abstract: MPL115A1 mpx6115 MPXV7002DP MPXY8320A MPX2202 Series how to connect pressure to MPX2102 MP3V5004DP LFSTBEB7660 mpxv6115vc6u
Text: LGA MMA7455L 2/4/8 XYZ 64 400 0.5 1.0 -/-/2.5 2.8/1.8 1.8 I2C/SPI 3 x 5 x 1.0 mm LGA Low g Analog Output Consumer Acceleration Sensors Product Sensing Range , x 1.0 mm LGA 3 x 5 x 1.0 mm LGA 3 x 5 x 1.0 mm LGA 3 x 5 x 1.0 mm LGA 6 x 6 x 1.45 mm QFN Low , Interface Package 2.4 - 5.5 2.4 - 5.5 10 10 50 - 115 50 - 115 ±1 ±1 -20°C ­ 85°C -20°C ­ 85°C SPI 8-pin LGA 8-pin LGA MPL115A1 MPL115A2 I2 C A Pressure Type2 D G


Original
PDF SG1010Q32009 MMA7660FC MMA7456L MMA7455L MPXY8300A6U MPL115A1 mpx6115 MPXV7002DP MPXY8320A MPX2202 Series how to connect pressure to MPX2102 MP3V5004DP LFSTBEB7660 mpxv6115vc6u
2006 - DS4077

Abstract: DS4077L-CCN DS4077L-DCN DS4077L-ECN DS4077L-EDN DS4077L-FCN l949a DS4077L-DDN
Text: Plastic LGA Package Clock-Data Recovery in Telecom/Datacom Applications Data Retiming Reference , LVCMOS 54 9 LGA DS4077L-DCN DS4077L-DDN -40°C to +85°C LVDS 54 9 LGA DS4077L-DDN DS4077L-CCN -40°C to +85°C LVCMOS 61.44 9 LGA DS4077L-CCN DS4077L-CDN -40°C to +85°C LVDS 61.44 9 LGA DS4077L-CDN Ordering Information continued at end of data , +) DS4077 VSS 3 CRYSTAL X2 VC VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION


Original
PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz 80MHz 20MHz. DS4077L-CCN DS4077L-DCN DS4077L-ECN DS4077L-EDN DS4077L-FCN l949a DS4077L-DDN
2006 - "Voltage Controlled Crystal Oscillator"

Abstract: 20MHz quartz crystal CRYSTAL 50MHZ datasheet DS4077L-EDN DS4077L-ECN DS4077L-DCN DS4077L-CCN DS4077 LGA Application Notes JEDEC Drawing LGA
Text: Plastic LGA Package Clock-Data Recovery in Telecom/Datacom Applications Data Retiming Reference , LGA DS4077L-DCN DS4077L-DDN -40°C to +85°C LVDS 54 9 LGA DS4077L-DDN DS4077L-CCN -40°C to +85°C LVCMOS 61.44 9 LGA DS4077L-CCN DS4077L-CDN -40°C to +85°C LVDS 61.44 9 LGA DS4077L-CDN DS4077L-DCN Ordering Information continued at end of data , (LVDSO+) OSC X2 VC VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION TRANSFER-MOLDED PLASTIC


Original
PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz 80MHz 20MHz. "Voltage Controlled Crystal Oscillator" 20MHz quartz crystal CRYSTAL 50MHZ datasheet DS4077L-EDN DS4077L-ECN DS4077L-DCN DS4077L-CCN LGA Application Notes JEDEC Drawing LGA
2006 - l949a

Abstract: No abstract text available
Text: Plastic LGA Package Clock-Data Recovery in Telecom/Datacom Applications Data Retiming Reference , LVCMOS 54 9 LGA DS4077L-DCN DS4077L-DDN -40°C to +85°C LVDS 54 9 LGA DS4077L-DDN DS4077L-CCN -40°C to +85°C LVCMOS 61.44 9 LGA DS4077L-CCN DS4077L-CDN -40°C to +85°C LVDS 61.44 9 LGA DS4077L-CDN Ordering Information continued at end of , +) DS4077 VSS 3 CRYSTAL X2 VC VARACTOR CONTROL DS4077 LGA ( ) LVDS OPTION


Original
PDF 50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz 80MHz 20MHz. l949a
2002 - X-RAY INSPECTION

Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
Text: /Glass PCB 1.15 mm 0.36-0.6 mm 0.7/0.8 mm 0.26/ 0.38 mm LGA Pad Epoxy Mold Cap 0.8, 1.0 , Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes , Array ( LGA ) is an area array matrix package that uses solder paste as the interconnect method, as , cross-section of the MAP and Overmolded LGA package. The MAP LGA uses a 0.26mm-0.38mm thick substrate , thickness ranges between 0.96mm and 1.12mm. The Overmolded LGA is similar in construction to the MAP LGA


Original
PDF AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
2008 - LTM4604AV

Abstract: LTM8021 LTM4607 LTM4605
Text: Very Low Profile Package: 15mm × 9mm × 2.3mm LGA (0.630mm Pads) APPLICATIONS ■■■â , design. The 0.630mm LGA pads with 1.27mm pitch simplify PCB layout by providing standard trace routing , small thermally enhanced 15mm × 9mm × 2.3mm LGA package and is Pb free and RoHS compliant , 4 5 6 7 8 9 10 11 VOUT GND LGA PACKAGE 66-PIN (15mm × 9mm × 2.3mm) 0.630mm PAD , ) LTM4604AEV#PBF LTM4604AEV#PBF LTM4604AV 66-Lead (15mm × 9mm × 2.3mm) LGA –40°C to 125Â


Original
PDF LTM4604A 630mm LTM8020 LTM8021 LTM8022 LTM8023 4604af LTM4604AV LTM8021 LTM4607 LTM4605
2008 - LTM4604AV

Abstract: 4604 G6-G11 lga 115 LTM8023 LTM4604A marking G5 4606a LTM8021 LTM4607
Text: Overtemperature Protection Small and Very Low Profile Package: 15mm × 9mm × 2.3mm LGA (0.630mm Pads , 0.630mm LGA pads with 1.27mm pitch simplify PCB layout by providing standard trace routing and via , enhanced 15mm × 9mm × 2.3mm LGA package and is Pb free and RoHS compliant. TYPICAL APPLICATION , 6 7 8 9 10 11 GND VOUT LGA PACKAGE 66-PIN (15mm × 9mm × 2.3mm) 0.630mm PAD TJMAX = , LTM4604AEV#PBF LTM4604AV 66-Lead (15mm × 9mm × 2.3mm) LGA ­40°C to 125°C LTM4604AIV#PBF


Original
PDF LTM4604A 630mm LTM4616 LTM8020 LTM8021 LTM8022 LTM8023 4604af LTM4604AV 4604 G6-G11 lga 115 LTM8023 LTM4604A marking G5 4606a LTM8021 LTM4607
2012 - land pattern 0805

Abstract: T5500
Text: -5th Order, LGA FL5-LGA Series Construction: High Purity Alumina Substrate Nickel alloy thin-film , , Absorptive Land Grid Array ( LGA ) for high bandwidth Competitive pricing Description: Thin Film Technology FL5, Land Grid Array ( LGA ) series of low pass filters are designed for cost effective use in , an absorptive, low pass function that attenuates high frequencies. The high bandwidth LGA surface , (6 pad LGA ) Z *Note: T&R package quantity (-T#) will be added to the part number by us


Original
PDF FL02M653 -10dB 100mA 100Mohm 50Vdc land pattern 0805 T5500
Not Available

Abstract: No abstract text available
Text: Array ( LGA ) for high bandwidth Competitive pricing Description: Thin Film Technology FL5, Land Grid Array ( LGA ) series of low pass filters are designed for cost effective use in applications where , absorptive, low pass function that attenuates high frequencies. The high bandwidth LGA surface mount , ) (50 ohm) (Bessel) (6 pad LGA ) = 19.0 GHz, = 21.0 GHz, = 23.0 GHz, = 25.0 GHz , Fo Cutoff Freq (-3dB) 19.0 to 25.0GHz in 1.0 GHz steps Fo (-3dB) ±5% (ie 23.0 ± 1.15 GHz) Fo


Original
PDF FL02M653 -10dB 100mA 100Mohm 50Vdc
2008 - LTM4607

Abstract: LTM4608
Text: — 15mm × 2.32mm LGA and 9mm × 15mm × 3.42mm BGA Packages Applications n n n n n , output capacitors are needed to complete the design. The 0.630mm LGA pads with 1.27mm pitch simplify , BGA PACKAGE 66-PIN (15mm × 9mm × 3.42mm) VOUT LGA PACKAGE 66-PIN (15mm × 9mm × 2.32mm , RATING TEMPERATURE RANGE (SEE NOTE 2) LTM4604AEV#PBF Au (RoHS) LTM4604AV e4 LGA 3 –40°C to 125°C LTM4604AIV#PBF Au (RoHS) LTM4604AV e4 LGA 3 –40°C to 125Â


Original
PDF LTM4604A com/LTM4604A 4604afb LTM4607 LTM4608
1993 - pcb design of zigbee

Abstract: FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
Text: Grid Array ( LGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99-Contact Land Grid Array ( LGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , -Pin LGA Package Information 3.1 71-Pin LGA Component Copper Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 71-Pin LGA Solder Mask . . . . . . . . . . . . , -Pin LGA Solder Paste Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Original
PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING an3553 LGA71 AN3345 fbga Substrate design guidelines 71-Contact QFN32 AN3003 AN2731
2009 - MPL115A

Abstract: MPL115A1 barometer i2c pressure sensor freescale barometer weather monitoring USING MICROCONTROLLER mpl115a2 AN3914 KITMPL115A1SPI KITMPL115A2I2C
Text: x 1.2 mm LGA package for space constrained applications. This surface mount package is , · Low-profile 3 x 5 x 1.2 mm LGA package MPL115A1T1 2.4­5.5V 5 A 50­115 kPa ± 1 kPa -20ºC­+85ºC SPI 8-pin LGA · Low current consumption MPL115A2T1 2.4­5.5V 5 A 50­115 kPa ± 1 kPa -20ºC­+85ºC I 2C 8-pin LGA Sleep mode: 1 A Active mode: 5 A at one , Convenient pressure conversion in units of kilopascals (kPa) · 50 to 115 kPa absolute pressure


Original
PDF MPL115A MPL115A MPL115A1 MPL115AFS MPL115A1 barometer i2c pressure sensor freescale barometer weather monitoring USING MICROCONTROLLER mpl115a2 AN3914 KITMPL115A1SPI KITMPL115A2I2C
2000 - EIA 364-60

Abstract: EIA-364-60 EIA-364-32 Socket-F Tyco AMD thermal design retention mechanism LGA 1207 socket F LF-LGA1207 EIA-364-21 EIA-364-20 EIA-364-11
Text: lever actuated Land Grid Array ( LGA ) 1207 position socket LGA1207 and LF-LGA1207 1. 108-78375 , performance, tests and quality requirements for the Tyco Electronics lever actuated Land Grid Array ( LGA , . All rights reserved. * : Trademark 1 of 8 Lever actuated Land Grid Array ( LGA ) 1207 position , Array ( LGA ) 1207 position socket Test Description Requirement 108-78375 Procedure , ) Rev. A 3 of 8 Lever actuated Land Grid Array ( LGA ) 1207 position socket Test Description


Original
PDF LGA1207 LF-LGA1207 EIA 364-60 EIA-364-60 EIA-364-32 Socket-F Tyco AMD thermal design retention mechanism LGA 1207 socket F LF-LGA1207 EIA-364-21 EIA-364-20 EIA-364-11
2015 - Not Available

Abstract: No abstract text available
Text: family of devices that integrates the crystal, synthesizer and fanout buffers in a single 5mm x 7mm LGA , ±50ppm total stability • -40°C to +85°C temperature range • 38-Pin 5mm x 7mm LGA package Block , MX852B B0063 Tube 38-Pin 5mm x 7mm LGA MX852BB0063 TR MX852B B0063 Tape and Reel 38-Pin 5mm x 7mm LGA Devices are Green and RoHS compliant. Sample material may have only a partial , VSS 38-Pin 5mm x 7mm LGA July 13, 2015 MX852B-1237-Rev 0.7 2 M9999


Original
PDF MX852BB0063 MX852BB0063 235fs 10G/12G 25MHz MX852B-1237-Rev M9999-071315-A
2008 - LTM4619

Abstract: No abstract text available
Text: — 15mm × 2.32mm LGA and 9mm × 15mm × 3.42mm BGA Packages Applications n n n n n , output capacitors are needed to complete the design. The 0.630mm LGA pads with 1.27mm pitch simplify , PACKAGE 66-PIN (15mm × 9mm × 3.42mm) VOUT LGA PACKAGE 66-PIN (15mm × 9mm × 2.32mm) 0.630mm PAD , RATING TEMPERATURE RANGE (SEE NOTE 2) LTM4604AEV#PBF Au (RoHS) LTM4604AV e4 LGA 3 –40°C to 125°C LTM4604AIV#PBF Au (RoHS) LTM4604AV e4 LGA 3 –40°C to 125Â


Original
PDF LTM4604A com/LTM4604A 4604afc LTM4619
13707RZ

Abstract: 13707RZ-S02L inphi S02l inphi Converter Inphi NRZ inphi terms
Text: Output signal swing 1100 mVpp differential Single power supply: +3.3 V Available in LGA package , land grid array ( LGA ) surface mount package. The packaged part is also available on an evaluation , ps RZ Pulse Width Adjust VPW VCC ­ 0.2 - VCC ­ 1.4 V 115 135 155 ps , 2009-04-06 13707RZ_DS_Ver2.3 Inphi Proprietary Page 5 of 9 LGA Pin Assignment Name Pin , Proprietary Page 6 of 9 LGA Package Outline Drawing Top View Side View Bottom View


Original
PDF 13707RZ OC-192 13707RZ 13707RZ-S02D, 13707RZ-S02 ISO-9001 13707RZ-S02L inphi S02l inphi Converter Inphi NRZ inphi terms
Inphi

Abstract: 25711xr LGA 1150
Text: Output signal swing 1150 mVpp differential Single 3.3 V power supply Available in LGA package or die , in a ceramic land grid array ( LGA ) package or in die form. The packaged part is also available on , (ps) OUTP Rise Time (ps) 12.5 12.0 11.5 11.0 -5 C 25 C 10.5 85 C 11.5 25 C , _DS_Ver3.1 Inphi Proprietary Page 9 of 12 LGA Pin Assignment Name Pin DIN1p 5 Non-inverting , Connected 25711XR_DS_Ver3.1 Function Supply NC Inphi Proprietary Page 10 of 12 LGA


Original
PDF 25711XR 25711XR Inphi LGA 1150
7303b

Abstract: LGA 1150 ED-7300 ED-7303B
Text: and LGA , tape used for interposer. (2) Package specific feature code According to Table 2 , position F Fine pitch (only used for BGA, LGA ) Terminal pitch is 0.5mm or less. (only used for , for PGA, BGA, LGA ) Note : Code "F" applied to QFP is not used for RENESASs QFP. (3) Basic , DIP SIP ZIP SVP PGA LGA BGA DTP QTP Basic package name Quad Flat Package Quad Flat , 14.50, 14.00×14.00 etc. New code 14.5, (6) 14×14 : 39.62 × 39.62, 11.5 × etc


Original
PDF ED-7303B. ED-7303B) ISO-R370) -SOP28 -QFP80 7303b LGA 1150 ED-7300 ED-7303B
Supplyframe Tracking Pixel