The Datasheet Archive

Top Results (6)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
BQ2052SN-A515 BQ2052SN-A515 ECAD Model Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70
BQ2052SN-A515G4 BQ2052SN-A515G4 ECAD Model Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70
CSD87501L CSD87501L ECAD Model Texas Instruments 30V, N ch NexFET MOSFET™, dual common drain LGA, 5.5mOhm 10-PICOSTAR
CSD83325L CSD83325L ECAD Model Texas Instruments 12V, N ch NexFET MOSFET™, dual LGA, 5.9mOhm 6-PICOSTAR
CSD87384M CSD87384M ECAD Model Texas Instruments 30V, Nch synchronous buck NexFET MOSFET™, 5x3.5 LGA, 30A 5-PTAB -55 to 150
CSD13381F4 CSD13381F4 ECAD Model Texas Instruments 12V, N ch NexFET MOSFET™, single LGA 1.0 x 0.6mm, 180mOhm 3-PICOSTAR -55 to 150

land pattern ssop8 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2006 - geophone

Abstract: geophone detector piezoelectric film sensor geophone sensor CSX750VBEL32 CS5371 board C8051F320 JTAG CS3301 delta-sigma modulators cs5371 CS5372
Text: land applications. Hydrophones are high-impedance sensors optimized to measure pressure in marine , restricts their current capacity to 10 mA. For land applications using the CS3301 amplifier (CRD5376 , CRD5376 Land Common Mode Filter Specification Common Mode Capacitance Common Mode Resistance Common Mode -3 dB Corner @ 6 dB/octave Value 10 nF + 10% 200 80 kHz + 10% Land Differential Filter , Surface Mount Package Type Supply Voltage, Current Value SN74LVC2G32DCTR SSOP-8 +2.5 V, 10 µA


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PDF CRD5376 CS3301 CS3302 CS5372 CS5376A CS4373A CRD5376 CS3301, CS3302, CS4373A, geophone geophone detector piezoelectric film sensor geophone sensor CSX750VBEL32 CS5371 board C8051F320 JTAG delta-sigma modulators cs5371
2007 - geophone sensor

Abstract: seismic sensor as earthquake detector geophone detector piezoelectric film sensor C13 SOT23-8 c86 sot23-8 CS3301A SP0503BAHTG geophone schottkey DIODE c19
Text: low-impedance sensors optimized to measure vibrations in land applications. Hydrophones are high-impedance , small physical size of these ESD diodes restricts their current capacity to 10 mA. For land , protect the amplifier inputs against transient voltage spikes. DS612RD2 13 CRD5376 Land , Corner @ 6 dB/octave Value 10 nF + 10% 200 80 kHz + 10% Land Differential Filter Specification , LittleLogic Dual-OR Surface Mount Package Type Supply Voltage, Current Value SN74LVC2G32DCTR SSOP-8


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PDF CRD5376 CS3301A CS3302A CS5372A CS5376A CS4373A CRD5376 CS3301A, CS3302A, CS4373A, geophone sensor seismic sensor as earthquake detector geophone detector piezoelectric film sensor C13 SOT23-8 c86 sot23-8 SP0503BAHTG geophone schottkey DIODE c19
2014 - AA112A

Abstract: IPC-7351A
Text: €6 . 40 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , €4 . 76 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , €14 . 110 . ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern , . 144 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , SOT523 . 178 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern


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PDF AP02002) AP02001) IPC-7351A) DFN0402â DFN0603â DFN0606â IPC-7351A, AA112A IPC-7351A
2007 - IPC-7351

Abstract: ipc7351 LQFP_EP IPC 7351 ADSP-21369 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369
Text: technical support. Land Pattern Compatibility Between 28x28 MQFP and LQFP Packages Contributed by Gregg , (LQFP_EP) package. The MQFP and LQFP_EP have different footprints. This EE-Note describes a land pattern , is 2.0 mm (1.0 mm on a side), with the same foot length. The land pattern design must accommodate , . Dimensions of MQFP and LQFP_EP packages If the PCB land pattern is designed per IPC-7351, the center of the land pattern of the MQFP package is offset in the positive x-direction relative to the LQFP_EP


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PDF EE-313 28x28 ADSP-21369 ADSP-21371 IPC-7351" IPC-7351, EE-313) IPC-7351 ipc7351 LQFP_EP IPC 7351 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369
2002 - LGK2309-0101

Abstract: 2.5mm stereo plug dimension surface mount jack 3 pole Recommended land pattern smd-0.5
Text: 4-2x2.5 ( Land ) 5 3 9 (Recommended P.W.Board Dimension) (The Pattern Side) 1 2 1.2 , 7.1 ø5.2 ø2.6 6.8 9 2-2.2x2.4( Land ) 4-2x2.4( Land ) (Recommended P.W.Board Dimension) (The Pattern , .6 0.1 Circuits 0.6 3 2-ø1.2 (Hole) 3.4 2-2.2x2.6 ( Land ) 2 1 1.5 1 2 1 3 2.4 2-2x2.6 ( Land ) (Recommended P.W.Board Dimension) (The Pattern Side) 1 SMD Type LGK2009-0201 3(3 POLE) 4 2 No printed , Circuits 3 3.4 2­ø1.2 (Hole) 2­2.2x2.6 ( Land ) 1.5 4 2 1 1 7.6 6 4 3 1 1 2 SMD Type LGK2009


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PDF 27gLGK1709-1601PWB LGK2002-0201LGK2009-0201/-0301 LGK1503-0301/-0501 LGK150901011 LGK1709-0101 LGK2509-0101 LGK2308-0301FLGK2309-0101SA LGK2308-0301FLGK1709-1601 LGK1709-1601 LGK2002-0201 LGK2309-0101 2.5mm stereo plug dimension surface mount jack 3 pole Recommended land pattern smd-0.5
2000 - land pattern for TSsOP 16

Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
Text: Tape and Reel Temp Go Package: TYPE PINS FOOTPRINT DRAWING CODE/VAR * N.SO; Land Pattern : Not , ) Land Pattern : 90-0097 (PDF) Use pkgcode/variation: S16-3* N.SO;16 pin Land Pattern : Not Available 0 , ) Land Pattern : 90-0097 (PDF) Use pkgcode/variation: S16-3* PDIP(N);16 pin;158.4 mm² Outline Drawing:21-0043 (PDF) Land Pattern : Not Applicable Use pkgcode/variation: P16-1* -40°C to +85°C RoHS , MAX4591EPE Buy Active PDIP(N);16 pin;158.4 mm² Outline Drawing:21-0043 (PDF) Land Pattern : Not


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PDF MAX4591/MAX4592/MAX4593 MAX4591 MAX4592 MAX4593 100pA MAX4581, MAX4582, MAX4583 MAX4617, land pattern for TSsOP 16 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
2012 - max17428

Abstract: MAX17401
Text: Order See data sheet Land Pattern : Not Available TQFN;32 pin;26 mm² Outline Drawing:21-0140 (PDF) Land Pattern : 90-0001 (PDF) Use pkgcode/variation: T3255+3* TQFN;32 pin;26 mm² -40°C to , MAX8796GTJ+GA4   Buy Custom Order Outline Drawing:21-0140 (PDF) Land Pattern : 90-0001 (PDF , RoHS/Lead-Free? Materials Analysis QFN; Buy Custom Order Land Pattern : Not Available QFN; Buy Buy Custom Order Active: Data sheet on request only Land Pattern : Not Available


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PDF MAX8796, MAX8797, MAX17401 MAX8796 MAX8797 MAX8796/MAX8797/MAX17401 max17428 MAX17401
2001 - LGK2009-0201

Abstract: LGK1709-1601 LGK2309-0101 LGK2002-0201 lgk20090201 LGK2308-0301F recommended land pattern for 0201 surface mount jack 3 pole
Text: 2-2x2.6 ( Land ) (Recommended P.W.Board Dimension) (The Pattern Side) 1 SMD Type LGK2009-0201 (3 POLE , circuit area. 4 2­2x2.6 ( Land ) 2.2x2 ( Land ) 2.4 (Recommended P.W.Board Dimension) (The Pattern Side , . 4 2­2x2.6 ( Land ) 2.2x2 ( Land ) 2.4 (Recommended P.W.Board Dimension) (The Pattern Side) SMD , 2-2.2x2.4( Land ) 4-2x2.4( Land ) (Recommended P.W.Board Dimension) (The Pattern Side) 2.8 10.2 0.4 , 4­1.8x2.4 ( Land ) 0.5 2.5 2.2 (Recommended P.W.Board Dimension) (The Pattern Side) 1.6 SMD Type (1


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PDF LGK1709-1601 LGK2002-0201 LGK2009-0201/-0301, LGK1503-0301/-0501 LGK1509-0101, LGK1709-0101 LGK2509-0101 LGK2308-0301F LGK2309-0101, LGK2009-0201 LGK2309-0101 lgk20090201 recommended land pattern for 0201 surface mount jack 3 pole
desoldering

Abstract: No abstract text available
Text: on an initial trial will be difficult to remove). (c) Note the target PCB QFP land pattern and the , accommodate the foot), but, handling the foot by the gold pins and placing on the land pattern by hand will , emulator foot will center the emulator foot on the land pattern . (f) Inspect solder fillets. Add , land QFP surface mount land solder paste L/3 Fig. 1 Top view of land pattern with paste Target PCB Fig. 2 Side view of emulator foot oriented over land pattern Page 1 of 2 LSI.doc


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PDF TL-DS123) desoldering
SOT-563 SOT-666

Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
Text: NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for , NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for , ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been , NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for


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PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 SOT-563 SOT-666 SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3
2006 - max232 free

Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
Text: No file text available


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PDF RS-232 MAX220 MAX249 EIA/TIA-232E MAX225, MAX233, MAX235, MAX245/MAX246/MAX247 MAX3222E/MAX3232E/MAX3237E/MAX3241E/ MAX3246E: max232 free AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
2012 - lqw04

Abstract: LQW21H T4 0506 LQW2UA LQP02T MURATA LQW15A
Text: RF Inductor Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor (chip coil) electrode. Land Pattern + Solder Resist Land Pattern Solder Resist (in mm) Series , Mounting 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip , floating and electrode leaching. (2) Land Pattern Designing (LQW series) Please follow the recommended


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PDF LQG15H LQG18H LQP02T LQP03T LQP15M LQP15M lqw04 LQW21H T4 0506 LQW2UA MURATA LQW15A
uwb antenna

Abstract: AF816M AH antenna ah316m INVERTED F PCB ANTENNA P4-17 086M555003
Text: Considerations Land pattern design Land pattern dimension examples Please don't arrange the surface and inside layer pattern near 1. PCB Design Recommended antenna land pattern for AF 216M/816M/116M , board. 2: Prescribes soldering area by a resist. Recommended antenna land pattern for AH 316M 1 2.2 1 1.2 0.5 GND Recommended antenna land pattern for AH 083F HIGH FREQUENCY DIELECTRIC COMPONENT Land for input terminal 50 input Recommended antenna land pattern for AH 104F


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PDF Humidity15 uwb antenna AF816M AH antenna ah316m INVERTED F PCB ANTENNA P4-17 086M555003
2009 - LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: consideration. The BGA land pattern footprint plays a key role in solder joint reliability, and the number of PCB layers required to route the balls. 3.1 Land Pad Design The PCB BGA land pads have to be , Footprints When building a BGA footprint the number one consideration is ensuring the ball pattern and , BGA land pad design are: · · The Solder mask defined land pad (SMD) The Non-solder mask defined land pad (NSMD); recommended type for PCB AN10778_1 Application note © NXP B.V. 2009. All


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PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
2003 - 900092

Abstract: 0/AN-900092
Text: DS1087LU11G 14.7456MHz, 2% Center Dither, 3V Buy Active Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8-1* µMAX;8 pin;15.6 mm² Outline Drawing:21-0036 (PDF) Land Pattern : 90-0092 (PDF) Use pkgcode , Active Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8+1* µMAX;8 pin;15.6 mm² Outline Drawing:21-0036 (PDF) Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8+1* µMAX;8 pin;15.6 mm² Outline Drawing , Active Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8+1* µMAX;8 pin;15.6 mm² Outline Drawing


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PDF DS1087L 130kHz mvp/id/3942/t/or 12-Jul-2012 900092 0/AN-900092
IPC-7351A

Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Text: NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for , suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary , suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary , DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been , land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending


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PDF IPC-7351A DFN1006-2 OD-323 OD-123 OD-523 DFN1006-3 DFN1310H4-6 DFN1612-6 IPC-7351A, AP02001 IPC-7351A DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
land pattern QFP 208

Abstract: qfp 64 land pattern IC SOCKET Yamaichi ic61 IC61-0644-052 IC61-0644-053 IC61-080-079 80P6N-A
Text: a target that is prepared for a 64P6N-A package MCU. The foot pattern 's land length needed to fit , target that is prepared for a 64P6N-A package MCU. The foot pattern 's land length needed to fit the IC , target that is prepared for an 64P6N-A package MCU. The foot pattern 's land length needed to fit the IC , on a target that is prepared for an 80P6N-A or 80P6-B package MCU. The foot pattern 's land length , pattern on a target that is prepared for an 80P6-B or 80P6N-A package MCU. The foot pattern 's land length


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PDF IC61-0644-052 64-pin IC61-0644-052 64P6N-A) 64P6N-A 64P6N-A. IC61-TOOL-4 100-pin land pattern QFP 208 qfp 64 land pattern IC SOCKET Yamaichi ic61 IC61-0644-053 IC61-080-079 80P6N-A
2005 - QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: L S SD QFN 48 PIN Component Dimensions needed for PCB Land Pattern Design Figure 3. QFN Component Dimensions Needed for PCB Land Pattern Design PCB Land Pattern The tolerance , 0.18 0.3 0.4 0.6 QFN 48 PIN PCB Land Pattern Figure 4. PCB Land Pattern Dimensions to be , Table 2. Board Land Pattern Dimensions Xmax 0.28 Board Land Pattern Dimensions Yref Amax Gmin , , defined in Figure 5, used to calculate the land pattern dimensions are: JS min Figure 5. Definition


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PDF
2010 - MAX16052

Abstract: MAX9019 MAX9015 MAX9016 MAX9017
Text: pin;9 mm² Outline Drawing:21-0078 (PDF) Land Pattern : 90-0176 (PDF) Use pkgcode/variation: K8-5* SOT;8 pin;9 mm² Outline Drawing:21-0078 (PDF) Land Pattern : 90-0176 (PDF) Use pkgcode/variation: K8+5* SOT;8 pin;9 mm² Outline Drawing:21-0078 (PDF) Land Pattern : 90-0176 (PDF) Use pkgcode/variation: K8-5* SOT;8 pin;9 mm² Outline Drawing:21-0078 (PDF) Land Pattern : 90-0176 (PDF) Use pkgcode/variation: K8 , FOOTPRINT DRAWING CODE/VAR * SOT;8 pin;9 mm² Outline Drawing:21-0078 (PDF) Land Pattern : 90-0176 (PDF) Use


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PDF MAX16052/MAX16053 mvp/id/3863/t/or 14-Mar-2011 MAX16052 MAX9019 MAX9015 MAX9016 MAX9017
2005 - FR4 epoxy pcb double sided

Abstract: double sided pcb, thermal via FR4 pcb led 3w ASMT ASMT-MT00 ASMT-MW20 double sided pcb FR4
Text: pattern Recommended soldering land pattern as shown below, can also be found in the technical datasheet. The metal slug of ASMT-Mxxx/ASMT-Axxx/ASMT-Jxxx can be directly soldered on the land pattern through , 0.10 Figure 5a. Recommended soldering land pattern for ASMT-Mxxx except ASMT-MT00 1.00 Figure 5b. Recommended soldering land pattern for ASMT-MT00 1.60 0.80 Solder Pad 3.50 Slug Indepdent 1.10 Figure 5c. Recommended soldering land pattern for ASMT-Axxx 1.75 Solder Pad


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PDF AV02-0082EN AV02-1958EN FR4 epoxy pcb double sided double sided pcb, thermal via FR4 pcb led 3w ASMT ASMT-MT00 ASMT-MW20 double sided pcb FR4
2008 - MAX1818EUT

Abstract: TOP CODE ABZH Dual N-Channel SOT-6 MOSFET max1818eut25 top mark ABZH sot23 abzk ABZH
Text: MAX1818EUT18-T Buy Active SOT;6 pin;9 mm² Outline Drawing:21-0058 (PDF) Land Pattern : 90-0175 (PDF) Use pkgcode/variation: U6FH-6* SOT;6 pin;9 mm² Outline Drawing:21-0058 (PDF) Land Pattern : 90-0175 (PDF) Use pkgcode/variation: U6FH-6* SOT;6 pin;9 mm² Outline Drawing:21-0058 (PDF) Land Pattern : 90-0175 (PDF) Use pkgcode/variation: U6F-6* SOT;6 pin;9 mm² Outline Drawing:21-0058 (PDF) Land Pattern : 90-0175 (PDF) Use pkgcode/variation: U6F-6* SOT;6 pin;9 mm² Outline Drawing:21-0058 (PDF) Land Pattern : 90-0175 (PDF) Use


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PDF 500mA MAX1818 120mV mvp/id/2383/t/or/pt/MAX1818 17-May-2012 MAX1818EUT TOP CODE ABZH Dual N-Channel SOT-6 MOSFET max1818eut25 top mark ABZH sot23 abzk ABZH
2010 - RP111N

Abstract: RP111H Z X C SOT-89-5 RP111L voltage regulator sot-89-5 RP111X
Text: (CE Pin) Output Voltage Output Current SOT-23-5 Power Dissipation (Standard Land Pattern )* Ambient , -55~125 V V V mA mW °C °C * For Power Dissipation and Standard Test Land Pattern , please refer , Standard Test Land Pattern Environment Board Material Board Dimensions Copper Ratio Through-holes , =125ºC) Standard Land Pattern Free Air Power Dissipation Thermal Resistance 420mW ja=(125-25°C)/0.42W=238 , Standard Land Pattern Free Air 0 25 50 75 85 100 125 150 Measurement Board Pattern


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PDF RP111x 500mA EA-241-100911 10pcs 1300mW 900mW 500mW RP111N RP111H Z X C SOT-89-5 RP111L voltage regulator sot-89-5
Y1 SOT-23

Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
Text: VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference , suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary , IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as , NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for , VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference


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PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 Y1 SOT-23 MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
2007 - Not Available

Abstract: No abstract text available
Text: No file text available


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PDF RS-232 MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E EIA/TIA-232 MAX3225EETP T2055 mvp/id/1847/t/or 26-Jul-2010
IPC-7351A

Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
Text: land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending , 0.45 Z ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern , MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad , MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad , NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for


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PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 IPC-7351A MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
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