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LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C
LTM4600IV#2DHPBF Linear Technology LTM4600 - 10A High Efficiency DC/DC µModule; Package: LGA; Pins: 104; Temperature: Industrial
LTM9004IV-AC#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C

land pattern ssop28 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2000 - land pattern ssop28

Abstract: SO18W SO20w package so24w SSOP20 LAND PATTERN SBFA015 SSOP-20 IPC-SM-782 smd sot 23/5 land pattern so18w
Text: board design. The Surface Mount Land Pattern Subcommittee of the Printed Board Design Committee of IPC , document "Surface-Mount Design and Land Pattern Standard" is designated IPC-SM-782. The criteria for a , land patterns are given for many JEDEC standard packages. Capability to customize the patterns for , -20 SSOP-24 SSOP-28 348 337 334 338 324 0.102 0.189 0.291 0.291 0.291 0.118 0.197 0.323 , -8 SSOP-20 SSOP-24 SSOP-28 348 337 334 338 324 2.60 4.80 7.40 7.40 7.40 3.00 5.00


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land pattern ssop28

Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
Text: board design. The Surface Mount Land Pattern Subcommittee of the Printed Board Design Committee of IPC , document "Surface-Mount Design and Land Pattern Standard" is designated IPC-SM-782. The criteria for a , , 1999 Incorrect Correct FIGURE 2. Device Placements. internet web site3. Surface mount land , -20 SSOP-24 SSOP-28 348 337 334 338 324 0.102 0.189 0.291 0.291 0.291 0.118 0.197 0.323 , -8 SSOP-20 SSOP-24 SSOP-28 348 337 334 338 324 2.60 4.80 7.40 7.40 7.40 3.00 5.00


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1998 - land pattern ssop28

Abstract: land pattern for SSOP16 SO18 TI land pattern so18w SSOP20 LAND PATTERN SBFA015A so24w IPC-SM-782 land pattern for SSOP56 smd sot 23/5
Text: Packaging Electronic Circuits (IPC)3 has established standards for PCB design. The Surface Mount Land Pattern Subcommittee of the Printed Board Design Committee of IPC has developed standard pad dimensions for the packages defined by the JEDEC committee. The IPC document Surface-Mount Design and Land Pattern Standard is designated IPC-SM-782. A properly designed solder pad minimizes solder bridging , . Surface-mount land patterns are given for many JEDEC standard packages. Capability to customize the patterns


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PDF SBFA015A land pattern ssop28 land pattern for SSOP16 SO18 TI land pattern so18w SSOP20 LAND PATTERN so24w IPC-SM-782 land pattern for SSOP56 smd sot 23/5
1999 - SOD87 footprint

Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
Text: respect to the actual position of the solder land pattern belonging to that component or component leads , .13 Requirements of solder land dimensions. MSB958 SOLDER RESIST PATTERN The solder resist on the circuit board , handbook, halfpage squeegee solder paste stencil solder land , , , , board , Ideally, the deposited solder paste should sit entirely on the solder land . The tolerated misplacement of solder paste with respect to the solder land is determined by the most critical component. The solder


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PDF MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
2005 - land pattern ssop28

Abstract: 1000 WATT smps circuit diagram SC1404ISS f 7413 C36-C40 IRF714 12v 50 A battery charger smps schematic F7413
Text: . 23 www.semtech.com SC1404 POWER MANAGEMENT Outline Drawing - TSSOP-28 PRELIMINARY Land Pattern - TSSOP-28 © 2005 Semtech Corp. 24 www.semtech.com SC1404 POWER MANAGEMENT Outline Drawing - SSOP-28 Land Pattern - SSOP-28 X DIM (C) G Z C G P X Y Z DIMENSIONS INCHES , SC1404ITSTR SC1404ITSTRT SC1404ISSTR SC1404ISSTRT -40 - +85°C TSSOP-28/ SSOP-28 SC1404 SSOP-28 (1) SSOP-28 (1)(2) Lead-free Option Note: (1) Only available in tape and reel packaging. A reel contains


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PDF SC1404 land pattern ssop28 1000 WATT smps circuit diagram SC1404ISS f 7413 C36-C40 IRF714 12v 50 A battery charger smps schematic F7413
2004 - land pattern ssop28

Abstract: 220 ac to 24 dc SMPS charger circuit diagram IRF714 12v 50 A battery charger smps schematic irf7143 ap amp mosfet 200 rms TSSOP-28 SSOP-28 SC1404ITSTR schematic diagram converter input 12v to 19v
Text: +85°C SC1404ISSTR SH D N # TEMP. (TAMB) SC1404ITSTR ON 3 PACKAGE SSOP-28 DH3 PH , 15 SEQ TSSOP-28/ SSOP-28 Block Diagram 2004 Semtech Corp. 8 www.semtech.com


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PDF SC1404 V/50mA 2V/200mA TSSOP-28 SSOP-28 land pattern ssop28 220 ac to 24 dc SMPS charger circuit diagram IRF714 12v 50 A battery charger smps schematic irf7143 ap amp mosfet 200 rms TSSOP-28 SSOP-28 SC1404ITSTR schematic diagram converter input 12v to 19v
K934

Abstract: CSP1034 Krypton isolation k952 TRANSISTOR SMD MARKING CODE R8 smd diode code GU k2950 K936 Motorola modem schematic diagram 56k MARKING d4 SMD PNP TRANSISTOR
Text: ) RECOMMENDED LAND PATTERN FOR K²934L, K²935L, K²935U AND K²936U Rev. 44F March/00 Advance data sheet , SSOP-28 Advance data sheet will change without notice AOUT AIN LCOM GAIN LINI IDI IDG LINE , ²952C SSOP-28 K²934L or K²935U SMD1206 Sidactor 300V SMD From Teccor Electronics P2600SB NPN 300V , Res 1.5K 1% 1/10W SSOP-16 SSOP-28 SMD1206 TO-92 U1 U2 C10, 11,12,13,14,15 V1 SOT


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PDF 950G/K 950GU 90/56Kbps K2934L UL1950 K2935U/ K2936U USB1300 220PF 73M2901 K934 CSP1034 Krypton isolation k952 TRANSISTOR SMD MARKING CODE R8 smd diode code GU k2950 K936 Motorola modem schematic diagram 56k MARKING d4 SMD PNP TRANSISTOR
2001 - smps 5v Power Supply Schematic Diagram

Abstract: circuit diagram of mosfet based smps power supply 6v smps circuit diagram of smps DESKTOP 4916 mosfet SCHEMATIC DIAGRAM SMPS 12v 2A 12V 2A SMPS circuit diagram SMPS CIRCUIT DIAGRAM for computers SC1402 basic smps
Text: = 15V VIN = 6V 17 www.semtech.com SC1402 POWER MANAGEMENT Outline Drawing - SSOP-28 Land Pattern Contact Information Semtech Corporation Power Management Products Division 652 , DEVICE TEMP. (TA) SC1402ISS Top View PACKAGE SSOP-28 -40 - +85°C Notes: 1. Only available in tape and reel packaging. A reel contains 1000 devices. SSOP-28 Pin Descriptions Pin


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PDF SC1402 SC1402 MAX1632 SSOP-28 smps 5v Power Supply Schematic Diagram circuit diagram of mosfet based smps power supply 6v smps circuit diagram of smps DESKTOP 4916 mosfet SCHEMATIC DIAGRAM SMPS 12v 2A 12V 2A SMPS circuit diagram SMPS CIRCUIT DIAGRAM for computers basic smps
SMD LTYN

Abstract: ic 4440 40w amplifier 12v Weston 2281 thermometer ltls e3 LT3060ITS8 Transistor SR 6863 TO-126 LTC3855EUH-1 5Dx diode SMD LTPG e3 LTABA
Text: No file text available


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PDF D-59387 D-73230 1-800-4-LINEAR SMD LTYN ic 4440 40w amplifier 12v Weston 2281 thermometer ltls e3 LT3060ITS8 Transistor SR 6863 TO-126 LTC3855EUH-1 5Dx diode SMD LTPG e3 LTABA
lm 7803 3V Positive Voltage Regulator

Abstract: ic 4440 40w amplifier 12v mt 1389 de ltsx e3 LM 4440 AUDIO AMPLIFIER CIRCUIT w10 mic package bridge rectifier PF08109B ul 1741 grid te inverter datasheet smd code marking 162 sot23-5 ltqt e3
Text: No file text available


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PDF D-59387 D-73230 1-800-4-LINEAR lm 7803 3V Positive Voltage Regulator ic 4440 40w amplifier 12v mt 1389 de ltsx e3 LM 4440 AUDIO AMPLIFIER CIRCUIT w10 mic package bridge rectifier PF08109B ul 1741 grid te inverter datasheet smd code marking 162 sot23-5 ltqt e3
mosfet 4800

Abstract: schematic diagram inverter 12v to 24v 30a schematic diagram inverter 500w USING MOSFET 4606 MOSFET INVERTER ltsx e3 mosfet driver ic mt 1389 de aot 110 optocoupler 4558 opamp schematic ic 4440 40w amplifier 12v LTPG e3
Text: No file text available


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PDF D-59387 D-73230 1-800-4-LINEAR mosfet 4800 schematic diagram inverter 12v to 24v 30a schematic diagram inverter 500w USING MOSFET 4606 MOSFET INVERTER ltsx e3 mosfet driver ic mt 1389 de aot 110 optocoupler 4558 opamp schematic ic 4440 40w amplifier 12v LTPG e3
2014 - AA112A

Abstract: IPC-7351A
Text: €6 . 40 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , €4 . 76 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , €14 . 110 . ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern , . 144 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , SOT523 . 178 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern


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PDF AP02002) AP02001) IPC-7351A) DFN0402â DFN0603â DFN0606â IPC-7351A, AA112A IPC-7351A
2007 - IPC-7351

Abstract: ipc7351 LQFP_EP IPC 7351 ADSP-21369 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369
Text: technical support. Land Pattern Compatibility Between 28x28 MQFP and LQFP Packages Contributed by Gregg , (LQFP_EP) package. The MQFP and LQFP_EP have different footprints. This EE-Note describes a land pattern , is 2.0 mm (1.0 mm on a side), with the same foot length. The land pattern design must accommodate , . Dimensions of MQFP and LQFP_EP packages If the PCB land pattern is designed per IPC-7351, the center of the land pattern of the MQFP package is offset in the positive x-direction relative to the LQFP_EP


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PDF EE-313 28x28 ADSP-21369 ADSP-21371 IPC-7351" IPC-7351, EE-313) IPC-7351 ipc7351 LQFP_EP IPC 7351 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369
2003 - 12v 50 A battery charger smps schematic

Abstract: land pattern ssop28 SMPS circuit for charging 6v battery capacitor 100N 19V 7.1A POWER SUPPLY schematic diagram 2 pin BERG CONNECTOR DL3 DIODE TSSOP-28 SSOP-28 SC1404ITSTR
Text: V+ TSSOP-28 SSOP-28 DH3 SH D N # TEMP. (TAMB) SC1404ITSTR ON 3 PACKAGE 21 , C SH 5 14 15 SEQ C OMP5 TSSOP-28/ SSOP-28 Block Diagram 2003 Semtech Corp. 8


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PDF SC1404 V/50mA 2V/200mA TTI-8215 SC1404ITS SSOP-28 TSSOP-28 12v 50 A battery charger smps schematic land pattern ssop28 SMPS circuit for charging 6v battery capacitor 100N 19V 7.1A POWER SUPPLY schematic diagram 2 pin BERG CONNECTOR DL3 DIODE TSSOP-28 SSOP-28 SC1404ITSTR
2002 - LGK2309-0101

Abstract: 2.5mm stereo plug dimension surface mount jack 3 pole Recommended land pattern smd-0.5
Text: 4-2x2.5 ( Land ) 5 3 9 (Recommended P.W.Board Dimension) (The Pattern Side) 1 2 1.2 , 7.1 ø5.2 ø2.6 6.8 9 2-2.2x2.4( Land ) 4-2x2.4( Land ) (Recommended P.W.Board Dimension) (The Pattern , .6 0.1 Circuits 0.6 3 2-ø1.2 (Hole) 3.4 2-2.2x2.6 ( Land ) 2 1 1.5 1 2 1 3 2.4 2-2x2.6 ( Land ) (Recommended P.W.Board Dimension) (The Pattern Side) 1 SMD Type LGK2009-0201 3(3 POLE) 4 2 No printed , Circuits 3 3.4 2­ø1.2 (Hole) 2­2.2x2.6 ( Land ) 1.5 4 2 1 1 7.6 6 4 3 1 1 2 SMD Type LGK2009


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PDF 27gLGK1709-1601PWB LGK2002-0201LGK2009-0201/-0301 LGK1503-0301/-0501 LGK150901011 LGK1709-0101 LGK2509-0101 LGK2308-0301FLGK2309-0101SA LGK2308-0301FLGK1709-1601 LGK1709-1601 LGK2002-0201 LGK2309-0101 2.5mm stereo plug dimension surface mount jack 3 pole Recommended land pattern smd-0.5
2000 - land pattern for TSsOP 16

Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
Text: Tape and Reel Temp Go Package: TYPE PINS FOOTPRINT DRAWING CODE/VAR * N.SO; Land Pattern : Not , ) Land Pattern : 90-0097 (PDF) Use pkgcode/variation: S16-3* N.SO;16 pin Land Pattern : Not Available 0 , ) Land Pattern : 90-0097 (PDF) Use pkgcode/variation: S16-3* PDIP(N);16 pin;158.4 mm² Outline Drawing:21-0043 (PDF) Land Pattern : Not Applicable Use pkgcode/variation: P16-1* -40°C to +85°C RoHS , MAX4591EPE Buy Active PDIP(N);16 pin;158.4 mm² Outline Drawing:21-0043 (PDF) Land Pattern : Not


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PDF MAX4591/MAX4592/MAX4593 MAX4591 MAX4592 MAX4593 100pA MAX4581, MAX4582, MAX4583 MAX4617, land pattern for TSsOP 16 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
2012 - max17428

Abstract: MAX17401
Text: Order See data sheet Land Pattern : Not Available TQFN;32 pin;26 mm² Outline Drawing:21-0140 (PDF) Land Pattern : 90-0001 (PDF) Use pkgcode/variation: T3255+3* TQFN;32 pin;26 mm² -40°C to , MAX8796GTJ+GA4   Buy Custom Order Outline Drawing:21-0140 (PDF) Land Pattern : 90-0001 (PDF , RoHS/Lead-Free? Materials Analysis QFN; Buy Custom Order Land Pattern : Not Available QFN; Buy Buy Custom Order Active: Data sheet on request only Land Pattern : Not Available


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PDF MAX8796, MAX8797, MAX17401 MAX8796 MAX8797 MAX8796/MAX8797/MAX17401 max17428 MAX17401
2001 - LGK2009-0201

Abstract: LGK1709-1601 LGK2309-0101 LGK2002-0201 lgk20090201 LGK2308-0301F recommended land pattern for 0201 surface mount jack 3 pole
Text: 2-2x2.6 ( Land ) (Recommended P.W.Board Dimension) (The Pattern Side) 1 SMD Type LGK2009-0201 (3 POLE , circuit area. 4 2­2x2.6 ( Land ) 2.2x2 ( Land ) 2.4 (Recommended P.W.Board Dimension) (The Pattern Side , . 4 2­2x2.6 ( Land ) 2.2x2 ( Land ) 2.4 (Recommended P.W.Board Dimension) (The Pattern Side) SMD , 2-2.2x2.4( Land ) 4-2x2.4( Land ) (Recommended P.W.Board Dimension) (The Pattern Side) 2.8 10.2 0.4 , 4­1.8x2.4 ( Land ) 0.5 2.5 2.2 (Recommended P.W.Board Dimension) (The Pattern Side) 1.6 SMD Type (1


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PDF LGK1709-1601 LGK2002-0201 LGK2009-0201/-0301, LGK1503-0301/-0501 LGK1509-0101, LGK1709-0101 LGK2509-0101 LGK2308-0301F LGK2309-0101, LGK2009-0201 LGK2309-0101 lgk20090201 recommended land pattern for 0201 surface mount jack 3 pole
desoldering

Abstract: No abstract text available
Text: on an initial trial will be difficult to remove). (c) Note the target PCB QFP land pattern and the , accommodate the foot), but, handling the foot by the gold pins and placing on the land pattern by hand will , emulator foot will center the emulator foot on the land pattern . (f) Inspect solder fillets. Add , land QFP surface mount land solder paste L/3 Fig. 1 Top view of land pattern with paste Target PCB Fig. 2 Side view of emulator foot oriented over land pattern Page 1 of 2 LSI.doc


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PDF TL-DS123) desoldering
SOT-563 SOT-666

Abstract: IPC-7351A SOD523 land pattern IPC SOD 323F SOT-353 G5 SOT-95 SOD-323 land pattern Y3 SOT23 DFN1006H4-3 DFN1006H4-2
Text: NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for , NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for , ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions , DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been , NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for


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PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 SOT-563 SOT-666 IPC-7351A SOD523 land pattern IPC SOD 323F SOT-353 G5 SOT-95 SOD-323 land pattern Y3 SOT23 DFN1006H4-3
2006 - max232 free

Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
Text: No file text available


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PDF RS-232 MAX220 MAX249 EIA/TIA-232E MAX225, MAX233, MAX235, MAX245/MAX246/MAX247 MAX3222E/MAX3232E/MAX3237E/MAX3241E/ MAX3246E: max232 free AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
2012 - lqw04

Abstract: LQW21H T4 0506 LQW2UA LQP02T MURATA LQW15A
Text: RF Inductor Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor (chip coil) electrode. Land Pattern + Solder Resist Land Pattern Solder Resist (in mm) Series , Mounting 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip , floating and electrode leaching. (2) Land Pattern Designing (LQW series) Please follow the recommended


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PDF LQG15H LQG18H LQP02T LQP03T LQP15M LQP15M lqw04 LQW21H T4 0506 LQW2UA MURATA LQW15A
uwb antenna

Abstract: AF816M AH antenna ah316m INVERTED F PCB ANTENNA P4-17 086M555003
Text: Considerations Land pattern design Land pattern dimension examples Please don't arrange the surface and inside layer pattern near 1. PCB Design Recommended antenna land pattern for AF 216M/816M/116M , board. 2: Prescribes soldering area by a resist. Recommended antenna land pattern for AH 316M 1 2.2 1 1.2 0.5 GND Recommended antenna land pattern for AH 083F HIGH FREQUENCY DIELECTRIC COMPONENT Land for input terminal 50 input Recommended antenna land pattern for AH 104F


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PDF Humidity15 uwb antenna AF816M AH antenna ah316m INVERTED F PCB ANTENNA P4-17 086M555003
2009 - LPC2468 reflow solder profile

Abstract: 0.65mm pitch BGA 1mm pitch BGA LFBGA32 AN10778 TFBGA208 MO-275 SOT1018-1 NXP LPC2368 lpc3154
Text: consideration. The BGA land pattern footprint plays a key role in solder joint reliability, and the number of PCB layers required to route the balls. 3.1 Land Pad Design The PCB BGA land pads have to be , Footprints When building a BGA footprint the number one consideration is ensuring the ball pattern and , BGA land pad design are: · · The Solder mask defined land pad (SMD) The Non-solder mask defined land pad (NSMD); recommended type for PCB AN10778_1 Application note © NXP B.V. 2009. All


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PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA LFBGA32 AN10778 TFBGA208 MO-275 SOT1018-1 NXP LPC2368 lpc3154
2003 - 900092

Abstract: 0/AN-900092
Text: DS1087LU11G 14.7456MHz, 2% Center Dither, 3V Buy Active Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8-1* µMAX;8 pin;15.6 mm² Outline Drawing:21-0036 (PDF) Land Pattern : 90-0092 (PDF) Use pkgcode , Active Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8+1* µMAX;8 pin;15.6 mm² Outline Drawing:21-0036 (PDF) Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8+1* µMAX;8 pin;15.6 mm² Outline Drawing , Active Land Pattern : 90-0092 (PDF) Use pkgcode/variation: U8+1* µMAX;8 pin;15.6 mm² Outline Drawing


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PDF DS1087L 130kHz mvp/id/3942/t/or 12-Jul-2012 900092 0/AN-900092
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