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Part Manufacturer Description Datasheet Download Buy Part
LTM4600DCM#PBF Linear Technology IC DC/DC UMODULE 10A 104-LGA
LTM4601IV-1#2DMPBF Linear Technology IC DC/DC UMODULE 12A 118-LGA
LTM4605EV#3CNPBF Linear Technology IC DC/DC UMODULE 5A 141-LGA
LTM4600IV#2DHPBF Linear Technology LTM4600 - 10A High Efficiency DC/DC µModule; Package: LGA; Pins: 104; Temperature: Industrial
LTM9004IV-AB#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C
LTM9004IV-AD#PBF Linear Technology LTM9004 - 14-Bit Direct Conversion Receiver Subsystem; Package: LGA; Pins: 204; Temperature Range: -40°C to 85°C

land pattern PQFP 132 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
land pattern PQFP 132

Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Text: LAND PATTERN DIMENSIONS l~P2l -rp2i- MIN MAX P 17.80 18.00 P1 14.40 14.60 P2 12.35 BSC X .30 , REDRAW TO JEDEC FORMAT 03/13/85 LAND PATTERN DIMENSIONS CEI _L resi - [IN- MIN MAX P 24.50 24.70 , DCN REV DESCRIPHON DATE APPROVED 27663 02 REDRAW TO JEDEC FORMAT 03/15/95 LAND PATTERN DIMENSIONS , PACKAGE DIAGRAM OUTLINES PQFP (Continued) PACKAGE DIAGRAM OUTLINES PQFP (Continued) DWG f , mm PQFP 1.60/.25 MAX FORM DRAWN ^ D1/IB/H CHECKED SIZE C DRAWING No. PSC-4035 REV 04


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PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 land pattern PQFP 132 PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
PA44QF14C-44QF

Abstract: PA44QF03-44QF PA44QF16-44QF 44QXQF QFP 128 pin Socket Enplas Enplas fpq FPQ-44-0.8-16 qfp 0.8mm Enplas OTQ
Text: land pattern on the prototype. Additional QFP Plugs can be purchased separately. Adapter Wiring , the dimension sets listed below: Socket 44QF-03 PQFP 44QF-14C PQFP 44QF-16 PQFP Body , mm typ Pitch 0.8 mm 10.0 mm typ 11.6 mm typ 13.2 mm typ 0.8 mm PA44QF16-44QF 0.8 mm The QFP plug will fit most 44 pin. 0.8mm pitch, QFP land patterns. Usually the pads extend


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PDF PA44QFxxx-44QF socket/44 44QF-03 44QF-14C 44QF-16 PA44QF16-44QF OTQ-44-0 PA44QF14C-44QF PA44QF03-44QF PA44QF16-44QF 44QXQF QFP 128 pin Socket Enplas Enplas fpq FPQ-44-0.8-16 qfp 0.8mm Enplas OTQ
m0-112

Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
Text: LAND PATTERN DIMENSIONS l~P2l -rp2i- MIN MAX P 17.80 18.00 P1 14.40 14.60 P2 12.35 BSC X .30 , REDRAW TO JEDEC FORMAT 03/13/85 LAND PATTERN DIMENSIONS CEI _L resi - [IN- MIN MAX P 24.50 24.70 , PACKAGE DIAGRAM OUTLINES PQFP (Continued) PACKAGE DIAGRAM OUTLINES PQFP (Continued) DWG f , mm PQFP 1.60/.25 MAX FORM DRAWN ^ D1/IB/H CHECKED SIZE C DRAWING No. PSC-4035 REV 04 DO NOT SCALE DRAWING | SHEET 2 OF 2 PACKAGE DIAGRAM OUTLINES PQFP (Continued) I» 1.20 (g>I C


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PDF PQ80- 5U-1982 M0-112, PS0-4035 P5C-4049 m0-112 land pattern PQFP 132 MO-069 tc 4049 MO-112
2004 - land pattern for TSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Text: © 2004 National Semiconductor Corporation MS011811 www.national.com Land Pattern Recommendations January 2004 Land Pattern Recommendations Plastic Quad Flat Packages ( PQFP ) 01181102 D D , Land Pattern Recommendations The following land pattern recommendations are provided as , 28.08 28.08 31.62 31.62 0.35 www.national.com 2 Land Pattern Recommendations , SSOP 3 www.national.com Land Pattern Recommendations EIAJ Small Outline, Shrink Small


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PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
2000 - land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern for TSOP 2
Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines , MS011811 www.national.com Land Pattern Recommendations August 1999 Land Pattern , 31.62 0.35 www.national.com 2 Land Pattern Recommendations JEDEC Small Outline and , 3 www.national.com Land Pattern Recommendations EIAJ Small Outline, Shrink Small Outline , Semiconductor packages: PLCC, PQFP , SOP, SSOP and TSOP. For SOT-23 (5-Lead) and TO-263 (3- or 5-Lead) packages


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PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern for TSOP 2
2003 - solder voids to263

Abstract: IEC 68-2-32 R/Detector/"detectors+ic"/"CD"/solder voids to263
Text: . At this point in the project it was discovered that the PCB land pattern for the 56L LLP was not , configurations (gull wing, J-bend, and land contact area). 2. Represent a wide range of package body sizes , packages. Table 1: Packages Selected for Board Level Qualification. Package 208L PQFP 84L PLCC 20L , Wing J-Bend J-Bend Gull Wing Gull Wing Land Contact Land Contact PCB Design and Board Level , temperature cycling system. The PCB was designed to accommodate, on each side of the board, four PQFP 208L


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2003 - IEC 68-2-32

Abstract: No abstract text available
Text: interface. At this point in the project it was discovered that the PCB land pattern for the 56L LLP was , configurations (gull wing, J-bend, and land contact area). 2. Represent a wide range of package body sizes , Qualification. Package 208L PQFP 84L PLCC 20L PLCC 9L TO-263 5L SC-70 56L LLP 8L LLP Body Size (mm , x 2.5 x 0.75 Lead Configuration Gull Wing J-Bend J-Bend Gull Wing Gull Wing Land Contact Land Contact PCB Design and Board Level Assembly Due to cost considerations, each PCB was designed


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PDF lead-f99, IEC 68-2-32
PCN0506

Abstract: Date Code Formats intel altera Date Code Formats flash device MARKing intel INTEL Date Code Formats Date Code Formats Altera EPC16UI88AA intel flash date code marking EPC16 Q-100
Text: Guardbands Foot Length = 1.2 mm Land pattern for Q100-02 ONLY X4 X5 Land pattern to accommodate both Q100-01 & Q100-02 X1 X2 X3 Land pattern for Q100-01 ONLY Option 1 23.2 mm - Nominal Length of , FineLine BGA® and 100-pin plastic quad flat pack ( PQFP ) packages containing the Intel flash memory will be , EPC16UC88AA EPC16QC100 EPC16QI100 EPC16UC88AB Fit: The new 100-pin PQFP package from ASEK, for both the , Information Data Sheet (http://www.altera.com/literature/ds/dspkg.pdf). The current 100-pin PQFP package


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PDF PCN0506 EPC16 EPC16 88-pin 100-pin EPC4QC100 EPC8QC100 EPC16UC88 E/12/2005 PCN0506 Date Code Formats intel altera Date Code Formats flash device MARKing intel INTEL Date Code Formats Date Code Formats Altera EPC16UI88AA intel flash date code marking Q-100
1998 - programming smt machine

Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 qfp 0.4mm wired pick and place robot water pumping machine control schematic
Text: Land Pattern Design The surface mount land patterns, also called footprints or pads, define the sites , or success of SMT is dependent upon the land pattern design. 7-6 1999 Packaging Databook , compounded the problem of standardizing the land pattern . There are a variety of package types offered by , manufacturing problems for SMC users. In this section, general guidelines are presented for land pattern design , pattern designs for reliability. A desirable requirement is that the land pattern design be transparent


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1998 - 240817

Abstract: SURFACE MOUNT TECHNOLOGY
Text: Land Pattern Design The surface mount land patterns, also called footprints or pads, define the sites , or success of SMT is dependent upon the land pattern design. 7-6 1998 Packaging Databook , problem of standardizing the land pattern . There are a variety of package types offered by the industry , manufacturing problems for SMC users. In this section, general guidelines are presented for land pattern design , pattern designs for reliability. A desirable requirement is that the land pattern design be transparent


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1997 - D2863-77

Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
Text: the package is thinner, and the dimensions governing the solder land pattern are different. The , of solder bumps. The bumps are soldered onto a land pattern on a circuit board in the end-use , Leaded Chip Carrier (PLCC) 44Ñ84 leads J-Bend/4 sides Quad Flat Pack ( PQFP ) 100Ñ240 leads , Land Pad Printed Circuit Board Figure 1: J-bend (on the left) and gull-wing lead formations (on the , PQFP package families include high-performance variations for devices having greater power and speed


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PDF 1970s D2863-77 Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
land pattern for TSOP 2 44 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208
Text: land pattern accommodates both PQFP and TQFP packages. im m u n i! `i l /' D -^ _ Controlling dimension: mm. 7.7 immimmiiiDDiiDiiiiinir Notes on land pattern 1 2 3 4 Pad requirement , 0° , 4 " a Al A2 100-pin PQFP and TQFP PCB land pattem Cl C2 DI D2 e Gl G2 N X Y ZI , leads. Based on the surface m ount Design and Land Pattern Standard in IPC-SM-782 rev. A, subsection , ] a2 208-pin plastic quad flat pack ( PQFP ) Ai Al b c D E 0.05 3.17 0.10 0.10 27.87 27.87 0.50 30.35


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PDF 512KX32 AS4LC512K32SG0 100-pin land pattern for TSOP 2 44 PIN land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin psop 44 land pattern PQFP 208
TQFP 14X20 land

Abstract: land pattern for TSOP 2 54 pin 64KX32 SOJ 44 PCB land TSOP 1826 land pattern tsop 66
Text: pattern This land pattern accommodates both PQFP and TQFP packages. c2 ' D2 tes ■- D2 -• -—± , 0.45 0.7S LI 1.60 aomiaal 1.00 nominal n -E- "1° A H Al A2 100-pin PQFP and TQFP PCB land pattern , 18.26 7? Ri/I miter Himeminn 74 16 74 76 This land pattern accommodates both PQFP and TQFP packages. C2 D2 inumimi 'il iiiiiiiiimn DH IIIII1IISIIIIIIIIDDIIDIMIIIII - G2- - 72 - Notes on land pattern 1 Pad , the center two leads. 15 Based on the surface mount Design and Land Pattern Standard in iPC-SM-782 rev


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PDF 64Kx5 64Kx32 1-10007-A. T00344C] TQFP 14X20 land land pattern for TSOP 2 54 pin SOJ 44 PCB land TSOP 1826 land pattern tsop 66
footprint jedec MS-026 TQFP

Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 TQFP 44 footprint jedec MS-026 LQFP 64 pin MS-026 BED AMD Package moisture BGA package tray 40 x 40 MO-069 MS-026
Text: leaded packages. Instead, the package is removed from the board, the land pattern redressed, and a new , assembly to form a bond with a corresponding land pattern of solder pads on the substrate. Traces from , , with industry standards established for both the JEDEC package outline and the IPC land pattern for , a matching land pattern on the circuit board in the end-use application. A solder mask is photo , has been established for both the JEDEC package outline and the IPC land pattern . Figure 2.3


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1998 - EPM9560RC304-15

Abstract: vhdl code for ARQ EASY 21653 EPM7064SLC44-10 EPM7032S through hole chip carriers EPM5064 Lexra PLMQ7192/256-160NC EPC1064 "pin-compatible" EPF10K100B
Text: pack (TQFP), 208-pin plastic quad flat pack ( PQFP ), 240-pin PQFP , 256-pin FineLine BGATM, and 484 , with 8.5-ns tDRR Available Today 208-pin PQFP -1, -2, -3 Q2 1999 256-pin FineLine BGA -1 , , -2, -3 Q2 1999 144-pin TQFP -1, -2, -3 Now 208-pin PQFP -1, -2, -3 Now 240-pin PQFP -1, -2, -3 Now 256-pin FineLine BGA -1, -2, -3 December 1998 484-pin FineLine BGA -1, -2, -3 December 1998 EPF10K100B 208-pin PQFP -1, -2, -3 Now 240-pin PQFP


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1998 - Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 conveyor belt alignment Intel reflow soldering profile BGA intel PLCC 68 intel reflow pcb warpage after reflow 80C196KB
Text: achieves more uniform solder paste volume within a given land pattern . 2. Move the hot air solder level at a 45 ° angle to the lands. This achieves more uniform solder volumes within a given land pattern , reflected in the reflow profile. The volume of solder paste on the land is significantly greater than the , affected by the loading pattern and drastic changes in the surrounding environment such as exhaust rate , land , and subsequently wicks up the component lead. Sufficient time must be allocated for foot and


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PDF conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 conveyor belt alignment Intel reflow soldering profile BGA intel PLCC 68 intel reflow pcb warpage after reflow 80C196KB
72741

Abstract: 2E15 MO-112
Text: REV DESCRIPTION DATE APPROVED 27648 05 REDRAW TO JEDEC FORMAT 03/13/85 LAND PATTERN DIMENSIONS CEI , PACKAGE DIAGRAM OUTLINES PQFP (Continued) I» 1.20 (g>I C IA-BID<5H I» 1.20 <8>I H IA-B(5 , ) 402-8874 TW» 010-338-2070 TITLE PM PACKAGE OUTLINE (RECT) 14.0 X 20.0 X 2.8 mm PQFP 1.95/.25 MIN FORM , PQFP (Continued) JEDEC f PQ100-2 s Y JEDEC VARIATION N B CC-1 U L MIN NOM MAX E A 2.80 - , PM PACKAGE OUTLINE (RECT) 14.0 X 20.0 X 2.8 mm PQFP 1.95/.25 MIN FORM_ SIZE DRAWING No. C PSC


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PDF 010-338-2OUTLINE MO-112, 12/15/BB PSC-4028 72741 2E15 MO-112
4B2S

Abstract: 72741 k 4110 tip 338 N80E
Text: LAND PATTERN DIMENSIONS l~P2l -rp2i- MIN MAX P 17.80 18.00 P1 14.40 14.60 P2 12.35 BSC X .30 , PACKAGE DIAGRAM OUTLINES PQFP (Continued) PACKAGE DIAGRAM OUTLINES PQFP (Continued) DWG f PQ80- s Y JEDEC VARIATION B BE-2 □ L MIN NOM MAX E A - - 2.35 A1 - - .25 A2 1.95 2.D0 2.10 D 16.95 17.20 17.45 4 D1 13.90 14.00 14.10 5,2 E 16.95 17.20 17.45 4 E1 13.90 14.00 14.10 5,2 , mm PQFP 1.60/.25 MAX FORM DRAWN ^ D1/IB/H CHECKED SIZE C DRAWING No. PSC-4035 REV 04


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PDF PQ80- 5U-1982 M0-10B, 850S4 PSC-4035 4B2S 72741 k 4110 tip 338 N80E
2006 - mp3 usb fm circuit with remote

Abstract: sanyo DA11 lqfp pcb LAYOUT mmc cARD PCB FOOTPRINT sanyo DA11 circuit diagram land pattern PQFP 208 servo control PCB diagram ES4810SAA usb mp3 lcd fm samsung lcd panel circuit diagram free
Text: shown below) for the heat dissipation to be effective. The land pattern for the chips still use the , recommended to route any traces between the land pattern and metal land . The specifications for the LQFP , printed circuit board (PCB) layout is required. The metal land on the underside of the IC must have , -pin LQFP ES4810FAA Digital Audio Processor 208-pin PQFP The first letter F in the part number identifies the package type PQFP . The first letter S in the part number identifies the package type LQFP


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PDF ES4810SAA ES4810SAA ES4810 ISO9660, FAT32. SAM0660-080406 mp3 usb fm circuit with remote sanyo DA11 lqfp pcb LAYOUT mmc cARD PCB FOOTPRINT sanyo DA11 circuit diagram land pattern PQFP 208 servo control PCB diagram usb mp3 lcd fm samsung lcd panel circuit diagram free
2001 - 44-pin plcc pcb mount footprint

Abstract: 27C64SO pic16c57 PCB Circuit PIC16C71SO PIC16C74P data programmers DIP PLCC SOIC textool 20P APT-PLCC16 Advanced Transdata development board Advanced Transdata Corporation
Text: and debugging of surface mount devices that are normally soldered to a land pattern on a PC board. Our , prototype board. DIP to SO-Plug adapters solder down to an SOIC land pattern and provide a DIP header for , land pattern and provide an SOIC test socket. Especially helpful when a device package is available in , , PLCC, PQFP and TQFP PICmicro® MCUs on any programmers with a DIP socket · SOIC, PLCC and TQFP emulation , , PIC16C77 (44P PQFP ) PIC17C4X (44P PQFP ) PIC12C508, PIC12C509, PIC12CE671, PIC12CE672 (8P 200 mil SM


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PDF DS00104F-page PIC12CXXX, PIC14C000, PIC16CXXX PIC17CXXX 28C64ASO 28C64AK PIC16C55SW W9711 44-pin plcc pcb mount footprint 27C64SO pic16c57 PCB Circuit PIC16C71SO PIC16C74P data programmers DIP PLCC SOIC textool 20P APT-PLCC16 Advanced Transdata development board Advanced Transdata Corporation
as7c36432-6qc

Abstract: 64KX32 tqfp 64 pcb land pattern TQFP 14X20 land
Text: ° PCB land pattern This land pattern accommodates both PQFP and TQFP packages. x CIDI Notes C2 D2 , Pattern Standard in IPC-SM-782 rev. A, subsection 11.3, 8/93 for PQFP . tqfp/ pqfp Symbol Description Min , »CCQ » I/030 I I/031 C NC t AS7C36432 PQFP ( 14mm x 20mm) & TQFP (14mm x 20mm) OO O , from a single 3.3V±0.3V supply. The AS7C36432 is packaged in a 100-pin 14x20 mm PQFP or TQFP package , * V1L min = -2.0V for pulse width less than tRC/2. Package dimensions A 9 pqfp tqfp Min Max Min


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PDF AS7C36432 64KX32 7C36432-S S12KB AS7C36432 AS7C36432-5QC AS7C36432-6QC AS7C3643 as7c36432-6qc tqfp 64 pcb land pattern TQFP 14X20 land
3232F-7

Abstract: PQFP dimension intel MI-003 pqfp 14x20 100pin
Text: 0.45 0.75 LI 1.60 1. 00 q 0° 10° 0° 7° PCB land pattern This land pattern accommodates both , . Based on the surface mount Design and Land Pattern Standard in IPC-SM-782 rev. A, subsection 11.3, 8/93 , n n n n n n n n n n n n n AS7C33232F PQFP (14mm x 20mm) & TQFP (14mm x 20mm) uuuuuuuuuuuuuuuuuuu , from a single 3.3V±0.3V supply and is packaged in a 100-pin 14x20 mm PQFP or TQFP package. Write , * V[L min = -2.0V for pulse width less than tRC/2. Package dimensions 100 Lead Quad Flatpack PQFP


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PDF 32KX32 AS7C33232F AS7C3323 256KB 512KB AS7C33232F 2321-6QC 3232F-7QC 3232F-7 PQFP dimension intel MI-003 pqfp 14x20 100pin
Not Available

Abstract: No abstract text available
Text: Yes Yes Yes No 100 PQFP 132 PQFP 168 PQFP 208 PQFP * 208 PQFP * 208 PQFP , access cycles. 208-pin Plastic Quad Flat Pack ( PQFP ) package 3.3-V power supply with 5-V-tolerant I/O , C E I N F O R M A T I O N CONNECTION DIAGRAM 208-Pin PQFP Top Side View n n n n n n n n n n , 7 8 9 10 11 146 145! 144 143 142 3 141 140 139 138 137 136 135 134 133 132 , – 0257525 DD51114 bTb ■ADVANCE INFORMATION AMD Ü PQFP PIN DESIGNATIONS (Pin Number) Pin


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PDF Am29240 Am29245 Am29243 andAm29243 17787C) Am29240EH Am29245EH
land pattern for TSOP 2 54 pin

Abstract: land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
Text: millimeters a Al A2 1 0 0 -pin PQFP and TQFP PCB land pattem TQFP/ PQFP M in This land pattern , mount Design and Land Pattern Standard in IPC-SM-782 rev. A, subsection 11.3, 8/93 for PQFP 622 DID , immimmiiiDDiiDiiiiinir Controlling dimension: mm. Notes on land pattern 1 2 3 4 Pad requirement to accommodate two , 16.34 1.0 _ k T 3 a2 T 2 0 8 -p in plastic quad flat pack ( PQFP ) Lead , 22.10 0.75 100-pin quad flat pack ( PQFP and TQFP) Al A2 0.25 2.57 0.20 0.4S 2.87 0.40 0.20


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PDF AS29LL8Ü 8/512K 48-pin land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin TSOP 54 land pattern 40013A land pattern for TSOP
1997 - pick and place robot

Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector edge mount sma footprint OMEGA P-M IPC-SM-782 300C SURFACE MOUNT TECHNOLOGY
Text: SMT. 7.3. 7.3.1. SURFACE MOUNT DESIGN Land Pattern Design The surface mount land patterns , standardizing the land pattern . There are a variety of package types offered by the industry, and the , for SMC users. In this section, we will present general guidelines for land pattern design that , guidelines are based on manufacturability and environmental testing of different land pattern designs for reliability. A desirable requirement is that the land pattern design be transparent to the soldering process


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PDF CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector edge mount sma footprint OMEGA P-M IPC-SM-782 300C SURFACE MOUNT TECHNOLOGY
Supplyframe Tracking Pixel