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T2111020101-000 TE Connectivity (T2111020101-000) HMN-002-MC
T2111020201-000 TE Connectivity (T2111020201-000) HMN-002-FC
5-1415410-2 TE Connectivity (5-1415410-2) 0410 63 053 002
1601142-1 TE Connectivity (1601142-1) 159-002-000=TAB,187X020,MMDSMZ
9-1415363-1 TE Connectivity (9-1415363-1) 0410 63 054 002
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jstd 002 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2015 - Not Available

Abstract: No abstract text available
Text: hours), samples from 4 IPC/EIA/JEDEC J-STD-002 12/0 IPC/EIA/JEDEC J-STD-002 12/0 , Lead Free solder IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 IPC/EIA/JEDEC J-STD-002 6/0 Thermal Shock Thermal Shock samples from


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PDF AN-00-004) AN-00-004 M150261 AN00004
2004 - J-STD-002

Abstract: CA110338 E174545 C0804
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 , C Recommended Pad Layout 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004


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PDF MF-SMDF050 J-STD-002 CA110338 E174545 C0804
2004 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3. 3.4 ± 0.1 (.134 ± .004) D Recommended Storage: 40 °C max , . 0.30 (0.012) Max. 1.09 (0.043) 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6


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PDF MF-SMDF050
2012 - iNAND SPEC

Abstract: No abstract text available
Text: % <0.75% Meets J-STD-002 <1.0% Method A <1.0% Meets J-STD-002 Method A Meets J-STD-002 Method A A


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PDF HRISTITEXAS53! iNAND SPEC
Not Available

Abstract: No abstract text available
Text: of ASNSI/ J-STD-002 . LEAD PULL & BEND TEST: Lead Pull Test: TAPE AND REEL CONFIGURATIONS: IC , RS296E EIA RS468 EIA RS376 EIA RS377 IEC 68 IEC 384 MIL 62 MIL 202 MIL C55514 ANSI/ J-STD-002


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PDF 0-50Hz ASNSI/J-STD-002.
2004 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± 0.1 (.063 ± .004) 2.0 ± 0.1


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PDF MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150
2004 - MF diode By 127

Abstract: J-STD-002 95% MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 jstd 002
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3. E , Layout C A 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± 0.1 (.063 ± .004) B


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PDF MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF diode By 127 J-STD-002 95% MF-NSMF012 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 jstd 002
2004 - MFSMDF030

Abstract: 0 281 002 472
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , Recommended Pad Layout 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1


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PDF MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 MFSMDF030 0 281 002 472
2004 - J-STD-002

Abstract: 0 281 002 472 MF-SMDF200 MF-SMDF150 MF-SMDF100 MF-SMDF050 MF-SMDF030 MF-SMDF150/33 J-STD-002 95% IEEE-472 074
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , View 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) B MM


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PDF MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 J-STD-002 0 281 002 472 MF-SMDF200 MF-SMDF150 MF-SMDF100 MF-SMDF050 MF-SMDF030 MF-SMDF150/33 J-STD-002 95% IEEE-472 074
2014 - Not Available

Abstract: No abstract text available
Text: % <0.75% Meets J-STD-002 Method A <1.0% <1.0% Meets J-STD-002 Method A Meets J-STD-002 Method A A


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2011 - J-STD-002

Abstract: 180 Ohm, 1 Watt Resistor
Text: % <0.75% Meets J-STD-002 <1.0% Method A <1.0% Meets J-STD-002 Method A Meets J-STD-002 Method A A


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PDF HRISTITEXAS53! TEXAS53! J-STD-002 180 Ohm, 1 Watt Resistor
Not Available

Abstract: No abstract text available
Text: capacitors meet the solderability requirements of ANSI/ J-STD 002 . Flow soldering can be used when the above , E.I.A. RS296D E.I.A. RS468A MIL-202F J.I.S.-C-5141 I.E.C. Standards ANSI/ J-STD-002 CLEANING


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PDF 100WVDC.
polyswitch u110

Abstract: rxe300 polyswitch u250 x030 PolySwitch polyswitch L025 RXE135 polyswitch application notes RUE300 RUE090 TR600
Text: LVR005 - 0.08 0.06 0.05 0.05 0.04 0.04 0.03 0.03 0.02 - New LVR008 , 0.02 - RXE010 0.16 0.14 0.11 0.10 0.096 0.08 0.072 0.067 0.05 0.04 , [0.52mm2 (20)] RUE600 6.0 12.0 30 - 40 3.5 30.0 16.0 0.005 0.02 0.04 , 0.005 0.02 0.03 R13, R15, R16 [0.52mm2 (20)] RUE800 8.0 16.0 30 - 40 4.0 40.0 18.8 0.005 0.013 0.02 R13, R15, R16 [0.52mm2 (20)] RUE900 9.0 18.0


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PDF IEEE-1394 265VAerature polyswitch u110 rxe300 polyswitch u250 x030 PolySwitch polyswitch L025 RXE135 polyswitch application notes RUE300 RUE090 TR600
2004 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , Recommended Pad Layout 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1


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PDF MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200
2004 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Optional Sn finish: Meets ANSI/ J-STD-002 Category 3 , Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 1.6 ± 0.1 (.063 ± .004) 2.0 ± 0.1


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PDF MF-NSMF012 MF-NSMF020 MF-NSMF035 MF-NSMF050 MF-NSMF075 MF-02)
2013 - JESD 201 class 1A

Abstract: No abstract text available
Text: /NHM3 JESD 22-B102 J-STD-002 and - halogen-free, RoHS compliant, and automotive Matte tin plated leads , Matte J-STD-002 and JESD 22-B102 J-STD-002 201 class22-B102 test meets JESD 2 whisker Terminals: Matte 22-B102 1A whisker test, HM3 suffix per J-STD-002 and JESD tin plated1Aleads, solderable suffix M3 suffix meets JESD 201 class JESD 201 class M3 suffix meets JESD 22-B102 J-STD-002 and JESD 201 , automated • Meets MSL voltage 1, per J-STD -020, LF • Low forward level drop, low power losses High


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PDF AEC-Q101 VMN-PT0203-1307 JESD 201 class 1A
2007 - J-STD-002

Abstract: JESD22-B104 JESD22-b103 20MHz quartz crystal JESD22-A109 JESD22B104 JESD22-B107 SARONIX RoHS NKS 2 NAD 20MHz Crystal SMD
Text: Solderability: J-STD-002 · Vibration: JESD22-B103 · Solvent Resistance: JESD22-B107 · Resistance to Soldering Heat: J-STD -020C Table 5-2 Pb-free devices (3 cycles max) Environmental: · Gross Test Leak , (non-RoHS package) · Solderability: J-STD-002 ( RoHS package ) · Terminal Strength: MIL-STD-883 Method 2004 , -202, Method 210, Condition I or J (Non-RoHS package) · Resistance to Soldering Heat: J-STD -020C Table 5-2


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PDF 10ppm, 20ppm, 30ppm J-STD-002( MIL-STD-883 JESD22-B103 JESD22-B107 MIL-STD-202, J-STD-020C JESD22-A109, J-STD-002 JESD22-B104 JESD22-b103 20MHz quartz crystal JESD22-A109 JESD22B104 JESD22-B107 SARONIX RoHS NKS 2 NAD 20MHz Crystal SMD
2005 - MF-SMDF050

Abstract: J-STD-002 95 MF-SMDF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH , Layout C Top and Bottom View 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1


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PDF MF-SMDF050 MF-SMDF050 J-STD-002 95 MF-SMDF150
PRCP-SMDF050

Abstract: SMDF050 "Power over Ethernet"
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , . 002 ) Terminal material: Electroless Ni under immersion Au 1.5 ± 0.05 (.059 ± . 002 ) Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. 4.6 ± 0.1 (.181 ±


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PDF PRCP-SMDF050 PRCP-SMDF050 SMDF050 "Power over Ethernet"
2004 - CA110338

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 , ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1 (.134 ± .004) D E


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PDF MF-SMDF050 MF-SMDF150* CA110338
2004 - CA110338

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. B D Typical Time , Layout 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1 (.134 ± .004


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PDF MF-SMDF050 Environmen079 CA110338
2005 - CA110338

Abstract: 01B6 E174545
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max , Side View C Recommended Pad Layout 1.0 ± 0.05 (.039 ± . 002 ) 1.0 ± 0.05 (.039 ± . 002 ) 2.5 ± 0.1 (.098


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PDF MF-USMF110 Envir79 CA110338 01B6 E174545
2005 - J-STD-002

Abstract: 77-1 MF-SMDF050 MF-SMDF150
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH , Layout C Top and Bottom View 1.5 ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1


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PDF MF-SMDF050 J-STD-002 77-1 MF-SMDF050 MF-SMDF150
2005 - Not Available

Abstract: No abstract text available
Text: .No arcing or burning Solderability .ANSI/ J-STD-002 , : Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 , ± 0.05 (.059 ± . 002 ) 1.5 ± 0.05 (.059 ± . 002 ) 4.6 ± 0.1 (.181 ± .004) 3.4 ± 0.1 (.134 ± .004) D E


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PDF MF-SMDF050 MF-SMDF150*
2011 - Not Available

Abstract: No abstract text available
Text: / J-STD-002 . 95 % min. coverage UL File Number , . Termination pad solderability: Standard Au finish: Meets ANSI/ J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. 4 D B 1.50 ± 0.10 (.059 ± .004) 1.00 ± 0.05 (.039 ± . 002 ) 1.20 ± , Amperes at 23 °C 0.5 8.00 8.00 8.00 8.00 8.00 Seconds at 23 °C 1.5 0.02 0.10 0.10 0.20 0.30 Tripped Power


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