The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC1706EMS-82#TR Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-82#TRPBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-82 Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-82#PBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-85#PBF Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C
LTC1706EMS-85 Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C

heat pipes intel Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2009 - 050074

Abstract: heat pipes X5570 E5520 E5530 LGA1366 E5506 heat pipes intel
Text: Xeon 5500 Series 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL , mainstream PCs. Their unique design removes heat using heat pipes , copper, and aluminum construction. Each , construction focusses on rapid heat removal from the chip using heat pipes , copper, and aluminum geometries , Zipper Fin w/ Advanced Hi-ContactTM Heat Pipes 050076 Backing Plate FOR MORE INFORMATION, VISIT , , E5506, E5504, E5502 Socket Type LGA 1366 Construction Base Aluminum Base w/ Heat Pipes


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2009 - 050235

Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
Text: INTEL ® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes , copper, and aluminum construction , heat pipes , copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum w/ Heat Pipes 050076 Backing Plate FOR MORE INFORMATION, VISIT OUR WEB SITE , Base Fins Aluminum Fin with Heat Pipes 36.0 1 Thermal Interface Material Shin-Etsu


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2009 - 050233

Abstract: Aavid thermalloy 9000 E5504 heat pipes intel LGA1366 heat pipes E5530 E5520 E5506 aavid
Text: Xeon 5500 Series Active 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL ® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream desktop PCs. Their unique design removes heat using heat pipes , copper, and aluminum , chip using heat pipes , copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat , Description 050233 Aluminum heat sink w/ Fan & Heat Pipes 050076 Backing Plate FOR MORE


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2009 - 050075

Abstract: E5540 LGA1366 l5520 Intel Xeon 5500 heat pipes E5506 E5530 W5580 X5570
Text: Xeon 5500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL ® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes , copper, and aluminum construction , heat pipes , copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum Base, Copper Plate Fins Aluminum Zipper Fin w/ Heat Pipes Thermal Interface Material1


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2009 - 050234

Abstract: LGA1257 heat pipes
Text: Xeon 7500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL ® XEON 7500 SERIES PROCESSORS Aavid's line of 7500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes , copper, and aluminum construction , heat pipes , copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum Zipper Fin with Advanced Hi-ContactTM Heat Pipes 322145 Backing Plate FOR MORE


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2009 - 050232

Abstract: Intel Xeon 5500 heat pipes LGA1366 X5570 AAvid 050232 Xeon 5500 X557
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL ® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes , copper, and aluminum construction , heat pipes , copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the , Aluminum Zipper Fin with Advanced Hi-ContactTM Heat Pipes 050076 Backing Plate FOR MORE


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2009 - E5520

Abstract: LGA1366 E5530 E5506 heat pipes E5540
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL ® XEON 5500 SERIES PROCESSORS Aavid's line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes , copper, and aluminum construction. Each heat sink comes with the necessary hardware and thermal interface for quick and easy assembly , heat pipes , copper, and aluminum geometries CRITICAL APPLICATION NEEDS: · Remove heat from the


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2008 - EP80579

Abstract: MULTIPLE EFFECT EVAPORATOR intel liquid cooling Sicc 32-1055 heat pipes loop heat pipes TRANSFORM heat exchanger process fanless motherboard
Text: well as Intel 's component specifications. Three Modes of Heat Transfer Conduction Thermal , remove the heat from component, these include: · 14 Heat pipes . A heat pipe is a device with , wick structure (in capillary action) at the inner wall of the heat pipes . This cycle will continue to occur as long as the temperature differential exists. Heat pipes are generally used to transfer the , exchanger. See an example of heat pipe in an active heatsink in Figure 12. In this case the heat pipes aid


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PDF EP805799 L5408, EP80579 MULTIPLE EFFECT EVAPORATOR intel liquid cooling Sicc 32-1055 heat pipes loop heat pipes TRANSFORM heat exchanger process fanless motherboard
2002 - heat sink

Abstract: prestonia pentium m 790
Text: intel std retention module Test performed with heat pipes in horozontal position Typical case-sink , Robust Design Uses Multiple Heat Pipes = High Performance Grease Interface Standard = Two , P R E L I M I N A R Y ® Pentium 4 1-U High Performance Heat Sink Part Number 037704 HIGH PERFORMANCE HEAT SINK DESIGNED FOR 1-U SERVER APPLICATIONS USING THE PENTIUM® 4 PROCESSOR (423 pin, XeonTM, Foster, Prestonia, Gallatin) Rely on Aavid Thermalloy's high performance heat pipe heat sink where


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1998 - agp card

Abstract: No abstract text available
Text: keepout on the backside of the AGP card was to allow the addition of a passive or active heat sink to the secondary side of the AGP card. Thermal vias or heat pipes would conduct heat through the card from the , heat sink is mounted to the secondary side of the card and is thermally linked to the thermal vias or heat pipes through the use of thermal grease or similar conducting material. Airflow on the secondary , figure referring to Note 3. Intel


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2004 - thermal test vehicle -intel

Abstract: X23776 G751
Text: Heat Sink for Intel ® Nocona TM 3.2GHz in 1U Servers Preliminary PASSIVE HEAT SINK FOR INTEL , ) 224-9988 Heat Sink for Intel ® NoconaTM 3.2GHz in 1U Servers Preliminary MECHANICAL DRAWING , Material1 Weight 603 pin and 604 pin Base plate Copper base with embedded heat pipes Fins Aluminum , thermal engineers who require high performance solution for single processor 1U servers. The heat sink exceeds Intel 's® performance requirements for both thermal performance and weight. FEATURES AND


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2002 - heat pipes

Abstract: prestonia aavid
Text: ) 2.5 (.10) Robust Design Uses Multiple Heat Pipes High Performance Grease Interface Standard = , : Test performed with heat pipes in vertical position Typical case-sink interface resistance = 0.02 to , Pentium® 4 2-U High Performance Heat Sink Part Number 037863 HIGH PERFORMANCE HEAT SINK , , Gallatin) Rely on Aavid Thermalloy's high performance heat pipe heat sink where design flexibility is required in a 2-U form factor. This style of heat sink can be customized to optimize fin spacing (even or


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2002 - thermalloy 250

Abstract: thermal resistance case heat sink 444X Aavid 315G heat pipes intel AAVID/-
Text: = Robust Design Uses Multiple Heat Pipes = High Performance Grease Interface Standard = , : Test performed with heat pipes in vertical position Typical case-sink interface resistance = 0.02 to , Pentium® 4 4-U High Performance Heat Sink Part Number 037862 HIGH PERFORMANCE HEAT SINK , , Gallatin) Rely on Aavid Thermalloy's high performance heat pipe heat sink where maximum thermal performance is required in a 4-U form factor. This style of heat sink can be customized to optimize fin


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2004 - honeywell pcm45

Abstract: CEK 550 PCM45F G751 thermal test vehicle -intel
Text: Heat Sink for Intel ® XeonTM Potomac MP and Nocona DP Processors in 4U Servers PASSIVE HEAT , solution for multi processor 4U servers. The heat sink is based on Intel 's® recommended design and meets , requirements for the Intel ® CEK retention system · Easy to attach · Hardware is captive to the heat sink , : WWW.AAVIDTHERMALLOY.COM TEL: (603) 224-9988 Heat Sink for Intel ® XeonTM Potomac MP and Nocona DP in 4U Servers , Aluminum frame with copper slug and embedded heat pipes Fins Stamped aluminum fins Shin Etsu G751


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2008 - Not Available

Abstract: No abstract text available
Text: find the widest applicability. Loop Heat Pipes for Cooling Computer Processors Heat pipes are , acquire, transport and reject heat from a source to a sink. The fact that heat pipes do not use , than heat pipes offer. Performance advantages include: • Higher maximum heat load • Longer , , et al [1] reported on the development and testing of various miniaturized loop heat pipes using , the CPU fan Fig. 7. Loop heat pipes installed in 1U server. heat sinks are about 72 °C, slightly


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1997 - intel packaging handbook 240800

Abstract: CompactPCI specification heat pipes intel TXC 82439HX Intel AP-759 tqfp 44 thermal resistance intel 82439hx 273143 EMBMOD166 EMBMOD133
Text: of heat through the board to the opposite side where thermal enhancements ( heat sinks, fans, pipes , the address listed in Appendix A. AP-759 7.1 Extruded Heat Sink Solution The Intel , lowers the performance of the heat pipe. Heat pipes can have a long life of 100,000 hours or more , Precaution The heat sink temperature should not rise above 95 °C at worst case power conditions. Intel , A AP-759 APPLICATION NOTE Intel Embedded Processor Module (EMBMOD133) Thermal Design


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PDF AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 CompactPCI specification heat pipes intel TXC 82439HX Intel AP-759 tqfp 44 thermal resistance intel 82439hx 273143 EMBMOD166 EMBMOD133
5TC-TTK-36-36

Abstract: 5tc-tt-k-36-36
Text: ., heat sinks, pipes ) are attached. Solder-side heat sinking, compared to TCP com ponent-side heat sinking , therm ocouples. Intel 's laboratory testing was done using a therm ocouple m ade by Om ega (part number , using highly therm ally conductive cem ents. Intel 's laboratory testing was done by using O m ega Bond , prim ary heat transfer path from the die of the TC P is through the back side of the die and into the , spread of heat w ithin the board and the dissipation of heat by the board to the am bient air. T he other


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PDF 243292B 5TC-TTK-36-36 5tc-tt-k-36-36
1998 - intel packaging handbook 240800

Abstract: hot wire mass airflow sensor tuflok heat pipes intel EMBMOD166 EMBMOD133 82439HX stamford voltage regulator drawn pin configuration of ic 7408 data sheet IC 7408
Text: of heat through the board to the opposite side where thermal enhancements ( heat sinks, fans, pipes , requirements. Intel only offers the Embedded Processor Module with a heat sink. The three available solutions , " Max Figure 4. Extruded Heat Sink Application Note 11 Intel Embedded Processor Module , Application Note Intel Embedded Processor Module Thermal Design Guide Figure 6. Corrugated Heat Sink , Note 15 Intel Embedded Processor Module Thermal Design Guide 7.7 Heat Sink Handling Safety


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PDF IASK9801 NP970255 intel packaging handbook 240800 hot wire mass airflow sensor tuflok heat pipes intel EMBMOD166 EMBMOD133 82439HX stamford voltage regulator drawn pin configuration of ic 7408 data sheet IC 7408
1999 - embedded rtos for voice over ip

Abstract: Nortel OC192
Text: there are several passive thermal control Controller methods, like heat plates/ pipes and finned heat , Engineer, Intel Corporation C ommunication-it makes the world go 'round. Yet today , : Intel Corporation 5000 West Chandler Blvd. Chandler, AZ 85226 Internet WEB address: http , D E D R E V I E W 2 INTEL CORPORATION Building Embedded Systems for an IP World A wide , enable companies Processor ASIC MAC to derive benefit from the huge investment in Intel ® Architecture (IA


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1997 - Intel reflow soldering profile BGA

Abstract: socket s1 REFLOW PROFILE outline of the heat slug for JEDEC intel topside mark heat pipes intel pbga package weight intel mother board circuit JEDEC bga 63 tray land pattern BGA 0,50 Lead Free reflow soldering profile BGA
Text: active or passive thermal management devices such as heat sinks or heat pipes . The electrical , CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC , with heatsinks 14-1 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication , Solder Balls Figure 14-1. PBGA Die Up Cross-Section 14-2 1/17/97 9:57 AM CH14WIP.DOC INTEL , /17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) AN INTRODUCTION TO


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PDF CH14WIP Intel reflow soldering profile BGA socket s1 REFLOW PROFILE outline of the heat slug for JEDEC intel topside mark heat pipes intel pbga package weight intel mother board circuit JEDEC bga 63 tray land pattern BGA 0,50 Lead Free reflow soldering profile BGA
1993 - apic - s03

Abstract: 243292 80286 microprocessor pin .doc format AM34 Diode T3 D46 PP0115 intel pentium MMX simd 1997 SL Enhanced Mobile Pentium Processor with MMX Technology Voltage Reduction Power Supply Design Considerations a
Text: iCOMP ® Index 2.0 Rating 166 MHz 160 Note: Contact Intel Corporation for more information about , applications for MS-DOS*, Windows*, OS/2*, and UNIX* and is the first microprocessor to support Intel MMX , processor with MMX technology has 4.5 million transistors and is built on Intel 's enhanced 3.3V CMOS , /19/96 3:42 PM 243292B.DOC INTEL CONFIDENTIAL (until publication date) MOBILE PENTIUM ® PROCESSOR WITH MMXTM TECHNOLOGY Information in this document is provided in connection with Intel


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PDF 32-Bit 64-Bit 16-Kbyte 243292B apic - s03 243292 80286 microprocessor pin .doc format AM34 Diode T3 D46 PP0115 intel pentium MMX simd 1997 SL Enhanced Mobile Pentium Processor with MMX Technology Voltage Reduction Power Supply Design Considerations a
2007 - arstech

Abstract: No abstract text available
Text: solutions for the major heat sources such as CPU and GPU modules use heat pipes and high flow rate fans to , plates and heat pipes have been used to improve the spreading of heat from heat sources such as the , collection and transport limitations of heat pipes [1] so higher flow rate system fans or additional local , two-phase capillary pumped systems such as loop heat pipes [2] or single or two-phase mechanically pumped , . Peterson, G.P., An Introduction to Heat Pipes : Modeling, Testing and Applications, Fourth Ed., Wiley, New


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PDF IPACK2007 IPACK2007-33870 D2570-96 arstech
2005 - Not Available

Abstract: No abstract text available
Text: IPACK2005-73445 TESTING THE THERMAL RESISTANCE AND POWER CAPACITY OF PRODUCTION HEAT PIPES Sukhvinder , years heat pipes have become widely use in high performance air-cooled heat sinks for cooling electronics equipment. Such heat sinks rely on the heat pipes to collect heat from small high heat flux , heat is transferred to an air flow stream by convection. When used effectively, heat pipes enable heat sinks that have low thermal resistance and low mass. For the heat sink to be successful, the heat pipes


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PDF IPACK2005 IPACK2005-73445
2012 - GDDR5 pinout

Abstract: coprocessor
Text: GDDR heat from the secondary side via heat pipes to the primary side thermal solution. Document ID , 'supersink' function, the duct contains internal fins, heat pipes , and diecast blower frame. The internal heat pipes serve to transmit heat from GDDR (both top- and bottom-side) and VR components to the , pipes . The internal heat pipes serve to transmit heat from GDDR (both top- and bottom-side) and VR , using this document, in addition to any agreements you have with Intel , you accept the terms set forth


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PDF 003EN GDDR5 pinout coprocessor
1996 - 242557

Abstract: AP-741 pentium family developer manual 241428 power supply detailed circuit used for PENTIUM 3 heat pipes intel INTEL application notes 82439HX 82371SB 430HX pciset datasheet
Text: techniques such as heat pipes and thermal sensors, and by using the mobile system chassis to vent heat , Intel 430HX PCIset Intel Corporation 5000 W. Chandler Blvd. Chandler, Arizona 85226 November , Information in this document is provided in connection with Intel products. No license, express or implied, by , in Intel 's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products


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PDF AP-741 430HX Consid242558 82439HX 82371SB 242557 AP-741 pentium family developer manual 241428 power supply detailed circuit used for PENTIUM 3 heat pipes intel INTEL application notes pciset datasheet
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