The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C

footprint mlf Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2003 - LM317 SOT223

Abstract: lm317 datasheet for 5v to 3.3v lm317 application circuit XAPP389 COOLRUNNER-II examples pcb layout for LM317 linear regulator lm317 5v to 3.3v lm317 for 3.3V footprint mlf adjustable voltage power supply using Lm317
Text: regulators are offered in small footprint MLF -10 packages, and offer a variety of configurations. The


Original
PDF XAPP389 com/bvdocs/publications/ds092 XC2C64 com/bvdocs/publications/ds093 XC2C128 com/bvdocs/publications/ds094 XC2C256 com/bvdocs/publications/ds095 XC2C384 com/bvdocs/publications/ds096 LM317 SOT223 lm317 datasheet for 5v to 3.3v lm317 application circuit XAPP389 COOLRUNNER-II examples pcb layout for LM317 linear regulator lm317 5v to 3.3v lm317 for 3.3V footprint mlf adjustable voltage power supply using Lm317
2003 - soic8 footprint

Abstract: soic8 SA25F040 SA25F080 SA25F160 16x512 SAIFUN flash footprint soic8 150 8x512 SA25F040 SOIC8 in mm
Text: in leadless MLF packages). The devices' small footprint saves board space and reduces system , , the SA25F System cost is affected by both footprint and package cost. Saifun's 512Kb to 16Mb SPI Serial Flash devices have the same small footprint as the industry standard's 8-pin narrow SOIC , with Saifun NROM technology and the devices' small footprint , gives a clear migration path from , MY CY CMY K Saifun's SA25F Family of SPI Serial Flash Memory Devices Small Footprint · 8


Original
PDF SA25F-cmyk SA25F 512Kb SA25F soic8 footprint soic8 SA25F040 SA25F080 SA25F160 16x512 SAIFUN flash footprint soic8 150 8x512 SA25F040 SOIC8 in mm
2003 - SA25C020

Abstract: SA25C1024 SA25C512 Saifun 2Mb SPI flash SAIFUN SEMICONDUCTORS LTD
Text: Key Features Small Footprint · 8-pin narrow SOIC package and lowprofile MLF leadless package The , footprint and package cost. Saifun's 512Kb to 2Mb SPI Serial EEPROM devices have the same small footprint as the industry standard's 8-pin narrow SOIC packages, or leadless MLF packages. The devices' small footprint saves board space and reduces system overhead cost. Enables new features and , Saifun NROM technology and the devices' small footprint , gives a clear migration path from low-density


Original
PDF SA25C-cmyk SA25C SA25C020 SA25C1024 SA25C512 Saifun 2Mb SPI flash SAIFUN SEMICONDUCTORS LTD
SU-25

Abstract: AT45DB041B-RU SU25 footprint mlf AT45DB041B-CC AT45DB041B-CI AT45DB041B-CNC AT45DB041B-CNU AT45DB041B-CU 8 soic pcb footprint
Text: -pad MLF . The 8-pad CASON has been replaced with the footprint compatible 8-lead SOIC, or for height restricted applications the narrow body MLF . 0.25mm Device 0.13mm Replacement Note AT45DB041B-CC , Note 1: Atmel recommends the 8-pad MLF package as a leadless small form factor alternative. A Board , change is required, or SU for footprint compatibility. Note 3: Atmel recommends the 8-pin SSU or SU for long term footprint migration path. Board change is required.recommends the 8-pin SOIC, either narrow


Original
PDF SC061901) 28pin AT45DB041D, AT45DB041D SU-25 AT45DB041B-RU SU25 footprint mlf AT45DB041B-CC AT45DB041B-CI AT45DB041B-CNC AT45DB041B-CNU AT45DB041B-CU 8 soic pcb footprint
2006 - MIC5335

Abstract: MIC5335-MGYMT marking AGW ASG sot-23
Text: offered in the ultra small 1.6mm x ® 1.6mm 6-ld Thin MLF package which is only 2.56mm2 in area of the SOT-23, TSOP and the 3mm x ® 3mm MLF package. The MIC5335 delivers exceptional thermal , voltage range Ultra-low dropout voltage: 75mV at 300mA Ultra Thin 1.6mm x 1.6mm 6 lead MLF ® package , : www.micrel.com. Typical Application MicroLead Frame and MLF are registered trademarks of Amkor Technologies , MIC5335-GFYMT AGF 1.8V/1.5V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF ® MIC5335-1.8/1.6YMT


Original
PDF MIC5335 300mA MIC5335 56mm2 OT-23, MIC5335-MGYMT marking AGW ASG sot-23
2006 - MIC5335

Abstract: regulator 6pin
Text: . The MIC5335 is offered in the ultra small 1.6mm x ® 1.6mm x 0.55mm 6-ld Thin MLF package, which is , voltage: 75mV at 300mA · Ultra Small 1.6mm x 1.6mm x 0.55mm 6 lead MLF ® package · Independent enable , trademark of Micrel, Inc. MLF and MicroLead Frame are registered trademarks of Amkor Technologies. Micrel , MIC5335-GFYMT GPF 1.8V/1.5V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF ® MIC5335-1.8/1.6YMT MIC5335-GWYMT GPW 1.8V/1.6V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF ® MIC5335-1.8/1.8YMT


Original
PDF MIC5335 300mA MIC5335 300mA M9999-051508 regulator 6pin
2003 - footprint mlf

Abstract: Security Cards SAIFUN SEMICONDUCTORS LTD SA24C SA24C1024 SA24C512
Text: cost is affected by both footprint and package cost. Saifun's 512Kb and 1Mb IIC Serial EEPROM devices have the same small footprint as the industry standard's 8-pin SOIC packages, and leadless MLF packages. The devices' small footprint saves board space and reduces system overhead cost. This enables , Devices Key Features Small Footprint · 8-pin SOIC package and low-profile MLF leadless package , , taken together with Saifun NROM technology and the devices' small footprint , gives a clear migration


Original
PDF SA24C footprint mlf Security Cards SAIFUN SEMICONDUCTORS LTD SA24C1024 SA24C512
2006 - footprint mlf

Abstract: MIC5335
Text: . The MIC5335 is offered in the ultra small 1.6mm x ® 1.6mm x 0.55mm 6-ld Thin MLF package, which is , : 75mV at 300mA · Ultra Small 1.6mm x 1.6mm x 0.55mm 6 lead MLF ® package · Independent enable pins · , and MLF are registered trademarks of Amkor Technologies. ULDO is a trademark of Micrel, Inc. Micrel , -Pin 1.6x1.6 Thin MLF ® MIC5335-1.8/1.6YMT MIC5335-GWYMT GPW 1.8V/1.6V ­40°C to +125°C 6-Pin 1.6x1.6 Thin MLF ® MIC5335-1.8/1.8YMT MIC5335-GGYMT GPG 1.8V/1.8V ­40°C to +125°C 6


Original
PDF MIC5335 300mA MIC5335 56mm2 300mA M9999-121206 footprint mlf
2006 - MIC5302

Abstract: No abstract text available
Text: MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF ® General Description Features , -pin 1.2mm x 1.6mm Thin MLF ® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data , · · · · Ultra Small 1.2mm x 1.6mm Thin MLF ® package Low Dropout Voltage: 50mV at 150mA


Original
PDF MIC5302 150mA MIC5302 150mA. M9999-052107-C
2006 - MIC5302

Abstract: footprint mlf
Text: MIC5302 150mA ULDOTM in Ultra-Small 1.2mm x 1.6mm Thin MLF ® General Description Features , ultra small 4-pin 1.2mm x ® 2 1.6mm Thin MLF package, occupying only 1.92mm of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. Its operating junction temperature , MLF ® package. Data sheets and support documentation can be found on Micrel's web site at www.micrel.com. · · · · · · · · · Ultra-small 1.2mm x 1.6mm Thin MLF ® package Low dropout voltage


Original
PDF MIC5302 150mA MIC5302 150mA. M9999-080510-F footprint mlf
2006 - MIC5303

Abstract: No abstract text available
Text: temperature range. Package JA Recommended Minimum Footprint 4-Pin 1.2x1.6 MLF ® 173°C/W , MLF ® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data sheets and , Ultra Small 1.2mm x 1.6mm Thin MLF ® package Low Dropout Voltage: 100mV at 300mA Output noise 120µVrms


Original
PDF MIC5303 300mA MIC5303 300mA. M9999-102506-B
2006 - Not Available

Abstract: No abstract text available
Text: ® package. Package 4-Pin 1.2x1.6 MLF ® JA Recommended Minimum Footprint 173°C/W Thermal Resistance , MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF ® General Description The MIC5302 is , , drawing no current when disabled. The MIC5302 is available in the ultra small 4-pin 1.2mm x 1.6mm Thin MLF , MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data sheets and support documentation


Original
PDF MIC5302 150mA MIC5302 150mA. M9999-0041408-D
2006 - MIC5302

Abstract: No abstract text available
Text: MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF ® General Description Features , -pin 1.2mm x 1.6mm Thin MLF ® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data , · · · · Ultra Small 1.2mm x 1.6mm Thin MLF ® package Low Dropout Voltage: 50mV at 150mA


Original
PDF MIC5302 150mA MIC5302 150mA. M9999-051508-E
2006 - MIC5303

Abstract: 12X16
Text: temperature range. Package JA Recommended Minimum Footprint 4-Pin 1.2x1.6 MLF ® 173°C/W , MLF ® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data sheets and , Ultra Small 1.2mm x 1.6mm Thin MLF ® package Low Dropout Voltage: 100mV at 300mA Output noise 120µVrms


Original
PDF MIC5303 300mA MIC5303 300mA. M9999-051508-D 12X16
2006 - MIC5302

Abstract: No abstract text available
Text: MIC5302 150mA ULDOTM in Ultra Small 1.2mm x 1.6mm Thin MLF ® General Description Features , -pin 1.2mm x 1.6mm Thin MLF ® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data , · · · · Ultra Small 1.2mm x 1.6mm Thin MLF ® package Low Dropout Voltage: 50mV at 150mA


Original
PDF MIC5302 150mA MIC5302 150mA. M9999-102506-B
2004 - SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 SG-BGA-6094 1mm pitch BGA socket BGA Solder Ball compressive force SG-MLF-7003 SG-BGA-6033 17X17* BGA 289
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent , BGA High Density Sockets . . . . . . . . . . . . . . . . . . . . . . . . . page SG.5 Ghz MLF High , backing plate. Alternative adapter bases are available that emulate the chip's BGA footprint and convert , .1 www.ironwoodelectronics.com Catalog XVII Ironwood Electronics GHz BGA and MLF Sockets SG.2 PART SELECTOR TABLE , SG.3 GHz BGA and MLF Sockets PART SELECTOR TABLE SG-BGA_Table-1mm IC Package Size Part


Original
PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 SG-BGA-6094 1mm pitch BGA socket BGA Solder Ball compressive force SG-MLF-7003 SG-BGA-6033 17X17* BGA 289
2007 - MIC5322

Abstract: MIC5322-MFYMT MIC5322-MGYMT MIC5322-NNYMT
Text: very compact 1.6mm x 1.6mm leadless Thin MLF ® package with exceptional thermal package , fixed-output voltages in a tiny 6-pin 1.6mm x 1.6mm leadless Thin MLF ® package which is only 2.56mm2 in area, - 30% less area than the SOT-23, TSOP and MLF ® 3x3 packages. Additional voltage options are , Ultra-low dropout voltage ULDOTM 35mV @ 150mA · Tiny 6-pin 1.6mm x 1.6mm Thin MLF ® leadless package · , ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor


Original
PDF MIC5322 150mA MIC5322 M9999-030608-A MIC5322-MFYMT MIC5322-MGYMT MIC5322-NNYMT
2008 - ZE12Y

Abstract: footprint mlf
Text: thermal resistance for the MIC47100 in the MLF ® package. Package JA Recommended Minimum Footprint 90 , with only a 1µF ceramic output capacitor and is available in a thermally enhanced 2mm × 2mm MLF , MLF ® package with an operating junction temperature range of -40°C to +125°C. Data sheets and support , ePad MSOP-8 ­ small form factor power package · Thermally enhanced 2mm × 2mm MLF ® ­ smallest solution , Typical Application MicroLead Frame and MLF are registered trademark of Amkor Technology


Original
PDF MIC47100 MIC47100 M9999-070808-A ZE12Y footprint mlf
2006 - marking AGW

Abstract: marking apg MIC5320 MIC5320-MMYML F MARKING 6PIN
Text: packages. JA Recommended Minimum Footprint Package 6-Pin 1.6x1.6 Thin MLF ® JC 100°C/W 2 , 1.6mm leadless Thin MLF ® package, which provides exceptional thermal package characteristics. The , 1.6mm leadless Thin MLF ® package which is only 2.56mm2 in area, less than 30% the area of the SOT-23, TSOP and MLF ® 3x3 packages. It's also available in the thin SOT-23-6 lead package and the standard 6 , Ultra-low dropout voltage ULDOTM 35mV @ 150mA Tiny 6-pin 1.6mm x 1.6mm Thin MLF ® leadless package Low


Original
PDF MIC5320 150mA MIC5320 150mA M9999-061407-E marking AGW marking apg MIC5320-MMYML F MARKING 6PIN
2004 - AN2222

Abstract: footprint mlf FOOTPRINT PCB Kester AN-2222 metcal
Text: . a. Line up the Flex-Pod with the PCB footprint . 3. Solder the Flex-Pod to the PCB by touching the , Window Picture 7. MLF Flex-Pod (Does not Require Pre-Tinning) AN2222 2. Line up the Flex-Pod with the PCB footprint : a. Put a drop of flux on the PCB footprint (Picture 8 shows how it is , the top of the head of the Flex-Pod is at the bottom of the PCB footprint so that the vias of the Flex-Pod are parallel to the pads on the PCB. (For MLF Flex-Pods, use the window to line up the pads as


Original
PDF AN2222 CY8C21x34, CY8C29x66 LF218 STTC-036 2331-Zx AN2222 footprint mlf FOOTPRINT PCB Kester AN-2222 metcal
2006 - MIC5303

Abstract: No abstract text available
Text: temperature range. Package JA Recommended Minimum Footprint 4-Pin 1.2x1.6 MLF ® 173°C/W , MLF ® package, occupying only 1.92mm2 of PCB area, a 50% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. It's operating junction temperature range is ­40°C to +125°C and is available in fixed output voltages in lead-free (RoHS compliant) Thin MLF ® package. Data sheets and , Ultra Small 1.2mm x 1.6mm Thin MLF ® package Low Dropout Voltage: 100mV at 300mA Output noise 120µVrms


Original
PDF MIC5303 300mA MIC5303 300mA. M9999-102407-C
2007 - MIC5322-MFYMT

Abstract: MIC5322-MGYMT MIC5322-NNYMT MIC5322
Text: very compact 1.6mm x 1.6mm leadless Thin MLF ® package with exceptional thermal package , fixed-output voltages in a tiny 6-pin 1.6mm x 1.6mm leadless Thin MLF ® package which is only 2.56mm2 in area, - 30% less area than the SOT-23, TSOP and MLF ® 3x3 packages. Additional voltage options are , Ultra-low dropout voltage ULDOTM 35mV @ 150mA · Tiny 6-pin 1.6mm x 1.6mm Thin MLF ® leadless package · , ULDO is a trademark of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor


Original
PDF MIC5322 150mA MIC5322 M9999-051508-B MIC5322-MFYMT MIC5322-MGYMT MIC5322-NNYMT
2005 - Not Available

Abstract: No abstract text available
Text: integrates two high-performance; 150mA ULDOs into a very compact 1.6mm x 1.6mm leadless MLF ® package that , 1.6mm leadless MLF ® package which is only 2.56mm2 in area, less than 30% the area of the SOT-23, TSOP and MLF 3x3 packages. It's also available in the thin SOT-23-6 lead package. Additional voltage , 5.5V input voltage range Ultra-low dropout voltage ULDOTM 35mV @ 150mA Tiny 6-pin 1.6mm x 1.6mm MLF , Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc. Micrel Inc. ·


Original
PDF MIC5321 150mA MIC5321 150mA M9999-073106
2005 - ZA28

Abstract: MIC5232 ZA33 ZA12 .za28 sot-23-5 marking code ml 31 MIC5232-3.3YD5 marking ZA28 mic5232-2
Text: in the 2mm x 2mm MLF ®-6 package. JA Recommended Package Minimum Footprint ® 2mm x 2mm MLF , . The MIC5232 is available in fixed output voltages in the miniature 6-pin 2mm x 2mm MLF ® package and , Input Miniature 6-pin 2mm x 2mm MLF ® package Lead-Free Thin SOT-23-5 Package Tight Load and Line , VOUT = 1.2V IOUT = 100µA COUT = 0.47µF 0 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 INPUT VOLTAGE (V) MLF , Pb-Free ®(3) Pb-Free MIC5232-1.2YML 12Z 1.2V ­40°C to +125°C 6-Pin 2mm x 2mm MLF


Original
PDF MIC5232 MIC5232 M9999-090508-C ZA28 ZA33 ZA12 .za28 sot-23-5 marking code ml 31 MIC5232-3.3YD5 marking ZA28 mic5232-2
2006 - MIC5301

Abstract: MIC5301YD5 MIC5301YML
Text: found on Micrel's website at: JA Recommended Minimum Footprint Package 6-Pin 1.6x1.6 MLF , shutdown and current limit protection · Tiny 6-pin 1.6mm x 1.6mm MLF ® leadless package · Thin SOT , 1.6mm x 1.6mm MLF ® package, occupying only 2.56mm2 of PCB area, a 36% reduction in board area compared to SC-70 and 2mm x 2mm MLF ® packages. The MIC5301 has an operating junction temperature range of , ) MLF ® and Thin SOT-23-5 packages. Applications Data sheets and support documentation can be found


Original
PDF MIC5301 150mA MIC5301 150mA M9999-111506 MIC5301YD5 MIC5301YML
Supplyframe Tracking Pixel