GHz BGA Sockets-0.8mm; IC Size X (mm): 11; IC Size Y (mm): 8; IC Array X: 12; IC Array Y: 8; Max Pincount: 96; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.5; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): 0.37; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.4; Max Package Code: BGA96; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)