High Density GHz BGA Sockets; Max Pincount: 400; Top Pitch (mm): 0.4; IC Array X: 20; IC Array Y: 20; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 2.5; IC Size X (mm): 9; IC Size Y (mm): 9; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.14; IC Ball Height Max (mm): 0.24; IC Ball Diameter Max (mm): 0.31; Max Package Code: BGA400; Part Description: GHz BGA Socket (ZIF)-HD
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