GHz BGA Sockets-1.27mm; IC Size X (mm): 40; IC Size Y (mm): 40; IC Array X: 31; IC Array Y: 31; Max Pincount: 432; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.7; Max Package Code: BGA432B; Backing Plate: yes; Cavity Down: yes; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF)
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